P

Inventor

WANG LIANG-WEI

TW20 patents
⚠️ This page may combine multiple inventors who share the name “WANG LIANG-WEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

19 patents
US11950432B2Apr 2, 2024

Semiconductor packages and method of manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations74
US11716910B2Aug 1, 2023

MRAM structure for balanced loading

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US12494422B2Dec 9, 2025

Semiconductor structure and method for forming the semiconductor structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12432933B2Sep 30, 2025

Semiconductor packages

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12356633B2Jul 8, 2025

Semiconductor devices and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12133469B2Oct 29, 2024

Magnetic random access memory and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12004431B2Jun 4, 2024

Structure and method for MRAM devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11937515B2Mar 19, 2024

MRAM structure for balanced loading

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11778918B2Oct 3, 2023

Magnetic memory cell with low-resistive electrode via and method of forming same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11744084B2Aug 29, 2023

Semiconductor devices and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12512433B2Dec 30, 2025

Semiconductor structures and methods for manufacturing the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12418010B2Sep 16, 2025

Semiconductor package with improved heat distribution

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12063790B2Aug 13, 2024

Structure and method for MRAM devices

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US12532761B2Jan 20, 2026

MIM capacitor in IC heterogenous integration

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations59
US12361994B2Jul 15, 2025

Semiconductor memory structure and method for forming the semiconductor memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations58
US12310252B2May 20, 2025

Semiconductor memory structure and method for forming the semiconductor memory structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations57
US12543545B2Feb 3, 2026

Redistribution layer and methods of fabrication thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations54
US12399210B2Aug 26, 2025

Wafer test pad

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations54
US12387772B2Aug 12, 2025

Structure and method for MRAM devices with a slot via

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52

NAT UNIV TSING HUA

1 patent