Inventor
TAKATSUKI RYO
JP5 patents
⚠️ This page may combine multiple inventors who share the name “TAKATSUKI RYO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
3 patentsUS5366933ANov 22, 1994
Method for constructing a dual sided, wire bonded integrated circuit chip package
INTEL CORP120 citations94
US5545922AAug 13, 1996
Dual sided integrated circuit chip package with offset wire bonds and support block cavities
INTEL CORP92 citations93
US5527740AJun 18, 1996
Manufacturing dual sided wire bonded integrated circuit chip packages using offset wire bonds and support block cavities
INTEL CORP74 citations93
TAKATSUKI RYO
2 patentsUS8076179B2Dec 13, 2011
Fabrication method for integrated circuit chip component, multi-chip module, and their integration structure
TAKATSUKI RYO2 citations56
US7977801B2Jul 12, 2011
Integrated circuit chip component, multi-chip module, their integration structure, and their fabrication method
TAKATSUKI RYO0 citations45