Inventor

CUONG DAO NGUYEN PHU

SG9 patents

⚠️ This page may combine multiple inventors who share the name “CUONG DAO NGUYEN PHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CAMACHO ZIGMUND RAMIREZ

3 patents

US9406531B1Aug 2, 2016

Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof

CAMACHO ZIGMUND RAMIREZ11 citations83

US9331003B1May 3, 2016

Integrated circuit packaging system with pre-molded leadframe and method of manufacture thereof

CAMACHO ZIGMUND RAMIREZ15 citations83

US9355983B1May 31, 2016

Integrated circuit packaging system with interposer structure and method of manufacture thereof

CAMACHO ZIGMUND RAMIREZ5 citations82

STATS CHIPPAC PTE LTD

3 patents

US9679769B1Jun 13, 2017

Integrated circuit packaging system with photoimagable dielectric-defined trace and method of manufacture thereof

STATS CHIPPAC PTE LTD1 citations51

US9659897B1May 23, 2017

Integrated circuit packaging system with interposer structure and method of manufacture thereof

STATS CHIPPAC PTE LTD0 citations50

US10109587B1Oct 23, 2018

Integrated circuit packaging system with substrate and method of manufacture thereof

STATS CHIPPAC PTE LTD0 citations49

CHI HEEJO

2 patents

US9502267B1Nov 22, 2016

Integrated circuit packaging system with support structure and method of manufacture thereof

CHI HEEJO4 citations72

US9406642B1Aug 2, 2016

Integrated circuit packaging system with insulated trace and method of manufacture thereof

CHI HEEJO1 citations51

CUONG DAO NGUYEN PHU

1 patent

US9412624B1Aug 9, 2016

Integrated circuit packaging system with substrate and method of manufacture thereof

CUONG DAO NGUYEN PHU6 citations76