Inventor · disambiguated record
Jui-I Yu
Also filed as: YU JUI-I
3 granted patents·1 pending application·20 citations·filing 2004–2008
67Inventor score
Technology areasH10W
Files withADVANCED SEMICONDUCTOR ENG3
Top patents by PatentIndex Score
4 records- 0176US7800240B2Under bump metallurgy structure and wafer structure using the same and method of manufacturing wafer structureADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Sep 21, 2010·10 cites·13 claims
- 0272US7518241B2Wafer structure with a multi-layer barrier in an UBM layer network device with power supplyADVANCED SEMICONDUCTOR ENG·Filed 2006·Granted Apr 14, 2009·7 cites·14 claims
- 0362US7816252B2Method for forming bumps on under bump metallurgyADVANCED SEMICONDUCTOR ENG·Filed 2008·Granted Oct 19, 2010·3 cites·19 claims
- 0430US2004259345A1Formation method of conductive bumpFiled 2004·Application pending·0 cites
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