Inventor
RENAVIKAR MUKUL
US7 patents
⚠️ This page may combine multiple inventors who share the name “RENAVIKAR MUKUL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
4 patentsUS7700476B2Apr 20, 2010
Solder joint reliability in microelectronic packaging
INTEL CORP15 citations91
US11817364B2Nov 14, 2023
BGA STIM package architecture for high performance systems
INTEL CORP3 citations71
US8030757B2Oct 4, 2011
Forming a semiconductor package including a thermal interface material
INTEL CORP4 citations62
US8018063B2Sep 13, 2011
Solder joint reliability in microelectronic packaging
INTEL CORP0 citations51