Inventor
HIRAKAWA TADASHI
JP41 patents
⚠️ This page may combine multiple inventors who share the name “HIRAKAWA TADASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI HEAVY IND LTD
21 patentsUS4863154ASep 5, 1989
Conveyor system for planar objects
MITSUBISHI HEAVY IND LTD25 citations93
US5496431AMar 5, 1996
Method and system for changing product specifications in a corrugation machine
MITSUBISHI HEAVY IND LTD23 citations92
US5297461AMar 29, 1994
Rotary shear
MITSUBISHI HEAVY IND LTD24 citations92
US4657236AApr 14, 1987
Sheet delivery device
MITSUBISHI HEAVY IND LTD47 citations92
US4667953AMay 26, 1987
Sheet stacker
MITSUBISHI HEAVY IND LTD59 citations91
US4010677AMar 8, 1977
Apparatus for positioning heads
MITSUBISHI HEAVY IND LTD40 citations91
US4238024ADec 9, 1980
Conveyor device
MITSUBISHI HEAVY IND LTD30 citations90
US4627831ADec 9, 1986
Single facer
MITSUBISHI HEAVY IND LTD27 citations89
US4460135AJul 17, 1984
Mill roll stand
MITSUBISHI HEAVY IND LTD24 citations82
US4706863ANov 17, 1987
Intermittent feeding apparatus for a continuous sheet
MITSUBISHI HEAVY IND LTD7 citations74
US4776578AOct 11, 1988
Apparatus for preventing disorder in sheet alignment
MITSUBISHI HEAVY IND LTD15 citations73
US4481066ANov 6, 1984
Single facer
MITSUBISHI HEAVY IND LTD20 citations73
US4337884AJul 6, 1982
Single facer
MITSUBISHI HEAVY IND LTD11 citations73
US4316761AFeb 23, 1982
Single facer
MITSUBISHI HEAVY IND LTD10 citations73
US4846778AJul 11, 1989
Slitter scorer including a head exchanging device
MITSUBISHI HEAVY IND LTD10 citations72
US4631109ADec 23, 1986
Single facer
MITSUBISHI HEAVY IND LTD15 citations71
US4471515ASep 18, 1984
Rolls for single facer
MITSUBISHI HEAVY IND LTD11 citations71
US4420999ADec 20, 1983
Rotary plate-shape material cutting arrangement
MITSUBISHI HEAVY IND LTD18 citations71
US4398328AAug 16, 1983
Rolls for single facer
MITSUBISHI HEAVY IND LTD5 citations60
US4327854AMay 4, 1982
Apparatus for guiding web-like material
MITSUBISHI HEAVY IND LTD1 citations52
US4644896AFeb 24, 1987
Lower roll apparatus for single facer
MITSUBISHI HEAVY IND LTD0 citations34
TEIJIN LTD
9 patentsUS4225642ASep 30, 1980
Raised and fused fabric filter and process for producing the same
TEIJIN LTD56 citations96
US4710432ADec 1, 1987
Base material for honeycomb core structure and process for producing the same
TEIJIN LTD30 citations93
US4501641AFeb 26, 1985
Process for producing paper or non-woven fabric
TEIJIN LTD27 citations93
US4496583AJan 29, 1985
Paper-like polyester fiber sheet and process for producing the same
TEIJIN LTD33 citations91
US4582747AApr 15, 1986
Dust-proof fabric
TEIJIN LTD39 citations89
US5436301AJul 25, 1995
Epoxy resin-impregnated prepreg
TEIJIN LTD11 citations74
US4529481AJul 16, 1985
Synthetic polyester pulp and process for preparing same
TEIJIN LTD17 citations74
US4154881AMay 15, 1979
Antistatic composite yarn and carpet
TEIJIN LTD24 citations74
US5240770AAug 31, 1993
Surface-modified wholly aromatic polyamide fiber and method of producing same
TEIJIN LTD10 citations72
HONDA MOTOR CO LTD
4 patentsUS7946616B2May 24, 2011
Side airbag apparatus
HONDA MOTOR CO LTD25 citations92
US11161549B2Nov 2, 2021
Vehicle body rear structure
HONDA MOTOR CO LTD7 citations84
US11097679B2Aug 24, 2021
Vehicle body rear structure
HONDA MOTOR CO LTD3 citations72
US10150353B2Dec 11, 2018
Door structure for vehicle
HONDA MOTOR CO LTD1 citations45
AMKOR ELECTRONICS INC
3 patentsUS5355283AOct 11, 1994
Ball grid array with via interconnection
AMKOR ELECTRONICS INC568 citations99
US5483100AJan 9, 1996
Integrated circuit package with via interconnections formed in a substrate
AMKOR ELECTRONICS INC45 citations96
US5378869AJan 3, 1995
Method for forming an integrated circuit package with via interconnection
AMKOR ELECTRONICS INC41 citations92
FUJI MACHINERY MFG & ELECTRONI
2 patentsUS6011694AJan 4, 2000
Ball grid array semiconductor package with solder ball openings in an insulative base
FUJI MACHINERY MFG & ELECTRONI240 citations98
US6040984AMar 21, 2000
Printed circuit board with opposed bonding shelves for semiconductor chip wire bonding at different levels
FUJI MACHINERY MFG & ELECTRONI103 citations97