P

Inventor

PIEHL ARTHUR

US18 patents
⚠️ This page may combine multiple inventors who share the name “PIEHL ARTHUR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HEWLETT PACKARD DEVELOPMENT CO

17 patents
US7072093B2Jul 4, 2006

Optical interference pixel display with charge control

HEWLETT PACKARD DEVELOPMENT CO161 citations99
US6741384B1May 25, 2004

Control of MEMS and light modulator arrays

HEWLETT PACKARD DEVELOPMENT CO301 citations99
US6829132B2Dec 7, 2004

Charge control of micro-electromechanical device

HEWLETT PACKARD DEVELOPMENT CO262 citations98
US7417307B2Aug 26, 2008

System and method for direct-bonding of substrates

HEWLETT PACKARD DEVELOPMENT CO36 citations92
US7040764B2May 9, 2006

Projection system using ambient light

HEWLETT PACKARD DEVELOPMENT CO29 citations92
US6853476B2Feb 8, 2005

Charge control circuit for a micro-electromechanical device

HEWLETT PACKARD DEVELOPMENT CO31 citations92
US7911693B2Mar 22, 2011

Ambient light absorbing screen

HEWLETT PACKARD DEVELOPMENT CO13 citations91
US7370185B2May 6, 2008

Self-packaged optical interference display device having anti-stiction bumps, integral micro-lens, and reflection-absorbing layers

HEWLETT PACKARD DEVELOPMENT CO13 citations84
US7733553B2Jun 8, 2010

Light modulator with tunable optical state

HEWLETT PACKARD DEVELOPMENT CO15 citations83
US7088566B2Aug 8, 2006

Charge control of micro-electromechanical device

HEWLETT PACKARD DEVELOPMENT CO12 citations83
US7221497B2May 22, 2007

Optical interference pixel display

HEWLETT PACKARD DEVELOPMENT CO9 citations74
US6628052B2Sep 30, 2003

Enhanced electron field emitter spindt tip and method for fabricating enhanced spindt tips

HEWLETT PACKARD DEVELOPMENT CO9 citations73
US7527381B2May 5, 2009

Optical system architecture

HEWLETT PACKARD DEVELOPMENT CO3 citations63
US7471441B1Dec 30, 2008

Flexures

HEWLETT PACKARD DEVELOPMENT CO3 citations62
US6817916B2Nov 16, 2004

Enhanced electron field emitter spindt tip and method for fabricating enhanced spindt tips

HEWLETT PACKARD DEVELOPMENT CO4 citations62
US7741157B2Jun 22, 2010

System and method for direct bonding of substrates

HEWLETT PACKARD DEVELOPMENT CO0 citations51
US7436571B2Oct 14, 2008

Micro-displays

HEWLETT PACKARD DEVELOPMENT CO0 citations51

PIEHL ARTHUR

1 patent