Inventor
NIU CHEN-YI
TW3 patents
Patents
3 patentsUS11742290B2Aug 29, 2023
Interconnect structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12469745B2Nov 11, 2025
Conductive structures with bottom-less barriers and liners
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12165975B2Dec 10, 2024
Method of forming interconnect structure having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60