Inventor
PENG HSIN-YING
TW4 patents
Patents
4 patentsUS11742290B2Aug 29, 2023
Interconnect structure and method of forming thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations71
US12354958B2Jul 8, 2025
Semiconductor devices and methods of formation
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12469745B2Nov 11, 2025
Conductive structures with bottom-less barriers and liners
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations60
US12165975B2Dec 10, 2024
Method of forming interconnect structure having a barrier layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60