Inventor
IWASAKI YORIO
JP12 patents
⚠️ This page may combine multiple inventors who share the name “IWASAKI YORIO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI CHEMICAL CO LTD
11 patentsUS5309632AMay 10, 1994
Process for producing printed wiring board
HITACHI CHEMICAL CO LTD66 citations95
US5929741AJul 27, 1999
Current protector
HITACHI CHEMICAL CO LTD71 citations93
US6236108B1May 22, 2001
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package
HITACHI CHEMICAL CO LTD24 citations92
US4216246AAug 5, 1980
Method of improving adhesion between insulating substrates and metal deposits electrolessly plated thereon, and method of making additive printed circuit boards
HITACHI CHEMICAL CO LTD48 citations92
US5486655AJan 23, 1996
Multiple wire adhesive on a multiple wire wiring board
HITACHI CHEMICAL CO LTD16 citations81
US5403869AApr 4, 1995
Adhesive of epoxy resins, epoxy-modified polybutadiene and photoinitiator
HITACHI CHEMICAL CO LTD17 citations81
US5323534AJun 28, 1994
Process for producing coaxial conductor interconnection wiring board
HITACHI CHEMICAL CO LTD17 citations80
US5233133AAug 3, 1993
Coaxial conductor interconnection wiring board
HITACHI CHEMICAL CO LTD17 citations80
US5584121ADec 17, 1996
Process for producing multiple wire wiring board
HITACHI CHEMICAL CO LTD12 citations72
US4791238ADec 13, 1988
High-density wired circuit board using insulated wires
HITACHI CHEMICAL CO LTD18 citations72
US5053280AOct 1, 1991
Adhesive composition for printed wiring boards with acrylonitrile-butadiene rubber having carboxyl groups and 20 ppm or less metal ionic impurities; an alkyl phenol resin; an epoxy resin; palladium catalyst, and coupling agent
HITACHI CHEMICAL CO LTD13 citations67