Inventor

KIM GEUN SIK

US7 patents

⚠️ This page may combine multiple inventors who share the name “KIM GEUN SIK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHIPPAC INC

2 patents

US7671451B2Mar 2, 2010

Semiconductor package having double layer leadframe

CHIPPAC INC41 citations91

US7880313B2Feb 1, 2011

Semiconductor flip chip package having substantially non-collapsible spacer

CHIPPAC INC17 citations87

STATS CHIPPAC LTD

2 patents

US7615851B2Nov 10, 2009

Integrated circuit package system

STATS CHIPPAC LTD3 citations62

US7785925B2Aug 31, 2010

Integrated circuit packaging system with package stacking and method of manufacture thereof

STATS CHIPPAC LTD0 citations49

LEE JAE SOO

1 patent

US8405230B2Mar 26, 2013

Semiconductor flip chip package having substantially non-collapsible spacer and method of manufacture thereof

LEE JAE SOO11 citations82

(unassigned)

1 patent

US6427291B1Aug 6, 2002

Buckle

LEE TAESUNG

1 patent

US8410587B2Apr 2, 2013

Integrated circuit package system

LEE TAESUNG0 citations50