Inventor

WONG BOH KID

MY4 patents

⚠️ This page may combine multiple inventors who share the name “WONG BOH KID”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YAP WENG FOONG

1 patent

US8927345B2Jan 6, 2015

Device package with rigid interconnect structure connecting die and substrate and method thereof

YAP WENG FOONG6 citations66

LAW LAI CHENG

1 patent

US8680660B1Mar 25, 2014

Brace for bond wire

LAW LAI CHENG3 citations51

YAP WENG F

1 patent

US8741666B1Jun 3, 2014

Methods relating to intermetallic testing of bond integrity between bond pads and copper-containing bond wires

YAP WENG F0 citations36

WONG BOH KID

1 patent

US9337167B2May 10, 2016

Wire bonding method employing two scrub settings

WONG BOH KID0 citations29