Inventor
BAEK HYUNGGIL
KR14 patents
⚠️ This page may combine multiple inventors who share the name “BAEK HYUNGGIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
13 patentsUS10872875B2Dec 22, 2020
Bonding head and method for bonding semiconductor package, and semiconductor package
SAMSUNG ELECTRONICS CO LTD7 citations80
US10418335B2Sep 17, 2019
Substrate, method of sawing substrate, and semiconductor device
SAMSUNG ELECTRONICS CO LTD2 citations70
US12087650B2Sep 10, 2024
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11688656B2Jun 27, 2023
Interposer and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12205925B2Jan 21, 2025
Semiconductor package having package substrate
SAMSUNG ELECTRONICS CO LTD0 citations60
US10916509B2Feb 9, 2021
Substrate, method of sawing substrate, and semiconductor device
SAMSUNG ELECTRONICS CO LTD1 citations59
US12557209B2Feb 17, 2026
Printed circuit board having cutting position identification mark and alignment mark and semiconductor package having the same
SAMSUNG ELECTRONICS CO LTD0 citations56
US12208541B2Jan 28, 2025
Dicing blade including diamond particles
SAMSUNG ELECTRONICS CO LTD0 citations55
US12469749B2Nov 11, 2025
Method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US12557712B2Feb 17, 2026
Semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50
US12494439B2Dec 9, 2025
Semiconductor packages having fixing members
SAMSUNG ELECTRONICS CO LTD0 citations50
US12530920B2Jan 20, 2026
Fingerprint sensor package and device including the same
SAMSUNG ELECTRONICS CO LTD0 citations47
US12308253B2May 20, 2025
Molded product for semiconductor strip and method of manufacturing semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations47