Inventor
LI JIANXUN
CN4 patents
⚠️ This page may combine multiple inventors who share the name “LI JIANXUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
CHARTERED SEMICONDUCTOR MFG
3 patentsUS6040243AMar 21, 2000
Method to form copper damascene interconnects using a reverse barrier metal scheme to eliminate copper diffusion
CHARTERED SEMICONDUCTOR MFG250 citations98
US6331479B1Dec 18, 2001
Method to prevent degradation of low dielectric constant material in copper damascene interconnects
CHARTERED SEMICONDUCTOR MFG84 citations97
US6465157B1Oct 15, 2002
Dual layer pattern formation method for dual damascene interconnect
CHARTERED SEMICONDUCTOR MFG16 citations80