Inventor
CHAN ARGUEDAS SERGIO
US9 patents
Patents
9 patentsUS11328978B2May 10, 2022
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
INTEL CORP6 citations84
US12009271B2Jun 11, 2024
Protruding SN substrate features for epoxy flow control
INTEL CORP2 citations70
US11776869B2Oct 3, 2023
Package with a highly conductive layer deposited on die using throughput additive deposition prior to TIM1 dispense
INTEL CORP0 citations61
US12362250B2Jul 15, 2025
Protruding SN substrate features for epoxy flow control
INTEL CORP0 citations59
US11881438B2Jan 23, 2024
First-level integration of second-level thermal interface material for integrated circuit assemblies
INTEL CORP0 citations59
US11776864B2Oct 3, 2023
Corner guard for improved electroplated first level interconnect bump height range
INTEL CORP0 citations59
US11328979B2May 10, 2022
Substrate integrated posts and heat spreader customization for enhanced package thermomechanics
INTEL CORP1 citations59
US12334453B2Jun 17, 2025
Soldered metallic reservoirs for enhanced transient and steady-state thermal performance
INTEL CORP0 citations49
US11004768B2May 11, 2021
Multi-chip package with partial integrated heat spreader
INTEL CORP0 citations43