Inventor
KITAMURA KAZUNORI
JP11 patents
⚠️ This page may combine multiple inventors who share the name “KITAMURA KAZUNORI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAN EI KAGAKU CO
4 patentsUS6812299B2Nov 2, 2004
Composition of epoxy resin-unsaturated acid adduct, (meth)acrylate and crystallizable epoxy resin
SAN EI KAGAKU CO7 citations72
US7410673B2Aug 12, 2008
Smooth board and process for preparing a smooth board
SAN EI KAGAKU CO3 citations61
US7396885B2Jul 8, 2008
Photo-setting and thermosetting resin composition, process for preparing plugged-through-hole printed wiring board and plugged-through-hole printed wiring board
SAN EI KAGAKU CO5 citations61
US9072205B1Jun 30, 2015
Surface mounting method utilizing active resin composition
SAN EI KAGAKU CO1 citations50
SAN-EI KAGAKU CO LTD
3 patentsUS9732183B2Aug 15, 2017
Method for manufacturing hole-filling printed wiring board, curable resin composition and hole-filling printed wiring board
SAN-EI KAGAKU CO LTD0 citations42
US9565754B2Feb 7, 2017
Solder-mounted board, production method therefor, and semiconductor device
SAN-EI KAGAKU CO LTD0 citations36
US9415469B2Aug 16, 2016
Resin composition for solder bump formation, solder bump formation method, and member having solder bumps
SAN-EI KAGAKU CO LTD0 citations36