Inventor

FILIPIAK STANLEY M

US20 patents

⚠️ This page may combine multiple inventors who share the name “FILIPIAK STANLEY M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FILIPIAK STANLEY M

MOTOROLA INC

Copper interconnect structure and method of formation

Method for capping copper in semiconductor devices

Method for forming a nitride layer using preheated ammonia

Process for forming a semiconductor device with an antireflective layer

Process for forming an intermetallic layer

Process for the selective encapsulation of an electrically conductive structure in a semiconductor device

Process for forming a combination hardmask and antireflective layer

Semiconductor device, memory cell, and processes for forming them

Process for forming a semiconductor device having an interconnect or conductive film electrically insulated from a conductive member or region

Method for forming a patterned layer using dielectric materials as a light-sensitive material

Method for forming an inlaid via in a semiconductor device

Method for forming a tensile plasma enhanced nitride capping layer over a gate electrode

Semiconductor device having a titanium-aluminum compound

FREESCALE SEMICONDUCTOR INC

Method of forming a semiconductor device having a diffusion barrier stack and structure thereof

Method of forming an interlayer dielectric

Process for forming an electronic device including transistor structures with sidewall spacers

Plasma enhanced nitride layer

Method of making a semiconductor device using treated photoresist

Dual plasma treatment barrier film to reduce low-k damage

Semiconductor device with hydrogen barrier and method therefor