P

Inventor

LEE SI-HOON

KR24 patents
⚠️ This page may combine multiple inventors who share the name “LEE SI-HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SAMSUNG ELECTRONICS CO LTD

16 patents
US7599193B2Oct 6, 2009

Tape circuit substrate with reduced size of base film

SAMSUNG ELECTRONICS CO LTD21 citations92
US7420270B2Sep 2, 2008

Tape wiring substrate and chip-on-film package using the same

SAMSUNG ELECTRONICS CO LTD20 citations92
US11181508B2Nov 23, 2021

Gas sensing device, electronic device including the gas sensing device, and gas sensing system

SAMSUNG ELECTRONICS CO LTD14 citations85
US7880286B2Feb 1, 2011

Tape wiring substrate and chip-on-film package using the same

SAMSUNG ELECTRONICS CO LTD12 citations84
US7495317B2Feb 24, 2009

Semiconductor package with ferrite shielding structure

SAMSUNG ELECTRONICS CO LTD14 citations84
US7915727B2Mar 29, 2011

Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same

SAMSUNG ELECTRONICS CO LTD8 citations82
US10386348B2Aug 20, 2019

Olfactory sensing device and method for measuring odor

SAMSUNG ELECTRONICS CO LTD11 citations81
US9709540B2Jul 18, 2017

Cover device with odor detector and electronic device having the same

SAMSUNG ELECTRONICS CO LTD12 citations81
US7948768B2May 24, 2011

Tape circuit substrate with reduced size of base film

SAMSUNG ELECTRONICS CO LTD6 citations74
US7309916B2Dec 18, 2007

Semiconductor package and method for its manufacture

SAMSUNG ELECTRONICS CO LTD9 citations73
US6919513B2Jul 19, 2005

Film carrier tape for semiconductor package and manufacturing method thereof

SAMSUNG ELECTRONICS CO LTD8 citations73
US7183660B2Feb 27, 2007

Tape circuit substrate and semicondutor chip package using the same

SAMSUNG ELECTRONICS CO LTD6 citations63
US7652366B2Jan 26, 2010

Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package

SAMSUNG ELECTRONICS CO LTD4 citations62
US7375426B2May 20, 2008

Semiconductor package

SAMSUNG ELECTRONICS CO LTD2 citations62
US7683476B2Mar 23, 2010

Semiconductor package film having reinforcing member and related display module

SAMSUNG ELECTRONICS CO LTD1 citations51
US10761047B2Sep 1, 2020

Formaldehyde detecting apparatus, and air treatment apparatus having the same

SAMSUNG ELECTRONICS CO LTD0 citations40

HONG HEE-JUNG

2 patents

SAMSUNG ELECTRIC

1 patent

KIM DONG-WOO

1 patent

CHOI KYOUNG-SEI

1 patent

AHN HEE-WON

1 patent

LEE SI-HOON

1 patent

KWON KYUNG-JOON

1 patent