Inventor
LEE SI-HOON
KR24 patents
⚠️ This page may combine multiple inventors who share the name “LEE SI-HOON”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS7599193B2Oct 6, 2009
Tape circuit substrate with reduced size of base film
SAMSUNG ELECTRONICS CO LTD21 citations92
US7420270B2Sep 2, 2008
Tape wiring substrate and chip-on-film package using the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US11181508B2Nov 23, 2021
Gas sensing device, electronic device including the gas sensing device, and gas sensing system
SAMSUNG ELECTRONICS CO LTD14 citations85
US7880286B2Feb 1, 2011
Tape wiring substrate and chip-on-film package using the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7495317B2Feb 24, 2009
Semiconductor package with ferrite shielding structure
SAMSUNG ELECTRONICS CO LTD14 citations84
US7915727B2Mar 29, 2011
Tape for heat dissipating member, chip on film type semiconductor package including heat dissipating member, and electronic apparatus including the same
SAMSUNG ELECTRONICS CO LTD8 citations82
US10386348B2Aug 20, 2019
Olfactory sensing device and method for measuring odor
SAMSUNG ELECTRONICS CO LTD11 citations81
US9709540B2Jul 18, 2017
Cover device with odor detector and electronic device having the same
SAMSUNG ELECTRONICS CO LTD12 citations81
US7948768B2May 24, 2011
Tape circuit substrate with reduced size of base film
SAMSUNG ELECTRONICS CO LTD6 citations74
US7309916B2Dec 18, 2007
Semiconductor package and method for its manufacture
SAMSUNG ELECTRONICS CO LTD9 citations73
US6919513B2Jul 19, 2005
Film carrier tape for semiconductor package and manufacturing method thereof
SAMSUNG ELECTRONICS CO LTD8 citations73
US7183660B2Feb 27, 2007
Tape circuit substrate and semicondutor chip package using the same
SAMSUNG ELECTRONICS CO LTD6 citations63
US7652366B2Jan 26, 2010
Pad arrangement of driver IC chip for LCD and related circuit pattern structure of tab package
SAMSUNG ELECTRONICS CO LTD4 citations62
US7375426B2May 20, 2008
Semiconductor package
SAMSUNG ELECTRONICS CO LTD2 citations62
US7683476B2Mar 23, 2010
Semiconductor package film having reinforcing member and related display module
SAMSUNG ELECTRONICS CO LTD1 citations51
US10761047B2Sep 1, 2020
Formaldehyde detecting apparatus, and air treatment apparatus having the same
SAMSUNG ELECTRONICS CO LTD0 citations40
HONG HEE-JUNG
2 patentsUS8665298B2Mar 4, 2014
Method for analyzing light profile of light source and device and method for driving local dimming of liquid crystal display device by using the same
HONG HEE-JUNG9 citations83
US8670006B2Mar 11, 2014
Local dimming driving method and device of liquid crystal display device
HONG HEE-JUNG13 citations82