Inventor
SONG EUN-SEOK
KR26 patents
⚠️ This page may combine multiple inventors who share the name “SONG EUN-SEOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
16 patentsUS7420270B2Sep 2, 2008
Tape wiring substrate and chip-on-film package using the same
SAMSUNG ELECTRONICS CO LTD20 citations92
US11244938B2Feb 8, 2022
Electronic device package
SAMSUNG ELECTRONICS CO LTD15 citations84
US10475774B2Nov 12, 2019
Semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations84
US7880286B2Feb 1, 2011
Tape wiring substrate and chip-on-film package using the same
SAMSUNG ELECTRONICS CO LTD12 citations84
US7495317B2Feb 24, 2009
Semiconductor package with ferrite shielding structure
SAMSUNG ELECTRONICS CO LTD14 citations84
US7489035B2Feb 10, 2009
Integrated circuit chip package having a ring-shaped silicon decoupling capacitor
SAMSUNG ELECTRONICS CO LTD12 citations84
US10424571B2Sep 24, 2019
Electronic device package
SAMSUNG ELECTRONICS CO LTD6 citations82
US10262967B2Apr 16, 2019
Semiconductor packages
SAMSUNG ELECTRONICS CO LTD4 citations72
US9893020B2Feb 13, 2018
Semiconductor device
SAMSUNG ELECTRONICS CO LTD5 citations72
US6720533B2Apr 13, 2004
Heater assembly for heating a wafer
SAMSUNG ELECTRONICS CO LTD11 citations72
US7705433B2Apr 27, 2010
Semiconductor package preventing generation of static electricity therein
SAMSUNG ELECTRONICS CO LTD3 citations63
US10665575B2May 26, 2020
Semiconductor package
SAMSUNG ELECTRONICS CO LTD1 citations62
US7936232B2May 3, 2011
Substrate for semiconductor package
SAMSUNG ELECTRONICS CO LTD5 citations62
US7508680B2Mar 24, 2009
Adjustable-inductance filter, tape distribution substrate comprising the filter, and display panel assembly comprising the tape distribution substrate
SAMSUNG ELECTRONICS CO LTD2 citations62
US7760044B2Jul 20, 2010
Substrate for semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations51
US10490509B2Nov 26, 2019
Substrate having power delivery network for reducing electromagnetic interference and devices including the substrate
SAMSUNG ELECTRONICS CO LTD0 citations42
SONG EUN-SEOK
5 patentsUS8143713B2Mar 27, 2012
Chip-on-board package
SONG EUN-SEOK9 citations81
US8120024B2Feb 21, 2012
Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
SONG EUN-SEOK3 citations62
US8085545B2Dec 27, 2011
Structure for blocking an electromagnetic interference, wafer level package and printed circuit board having the same
SONG EUN-SEOK2 citations61
US8647976B2Feb 11, 2014
Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
SONG EUN-SEOK1 citations51
US8552521B2Oct 8, 2013
Semiconductor package to remove power noise using ground impedance
SONG EUN-SEOK0 citations51