Inventor
TSENG YA-WEN
TW7 patents
⚠️ This page may combine multiple inventors who share the name “TSENG YA-WEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
6 patentsUS10283496B2May 7, 2019
Integrated circuit filler and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD10 citations90
US10679980B2Jun 9, 2020
Integrated circuit filler and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations81
US10388645B2Aug 20, 2019
Integrated circuit filler and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations81
US11309307B2Apr 19, 2022
Integrated circuit filler and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations70
US12183729B2Dec 31, 2024
Integrated circuit filler and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US11776948B2Oct 3, 2023
Integrated circuit filler and method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60