Inventor
TSENG LI-HSIN
TW8 patents
⚠️ This page may combine multiple inventors who share the name “TSENG LI-HSIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG
5 patentsUS6486054B1Nov 26, 2002
Method to achieve robust solder bump height
TAIWAN SEMICONDUCTOR MFG25 citations91
US6696356B2Feb 24, 2004
Method of making a bump on a substrate without ribbon residue
TAIWAN SEMICONDUCTOR MFG23 citations89
US7122458B2Oct 17, 2006
Method for fabricating pad redistribution layer
TAIWAN SEMICONDUCTOR MFG35 citations88
US7187078B2Mar 6, 2007
Bump structure
TAIWAN SEMICONDUCTOR MFG13 citations80
US7459386B2Dec 2, 2008
Method for forming solder bumps of increased height
TAIWAN SEMICONDUCTOR MFG14 citations79