Inventor
HUANG GIL
TW3 patents
Patents
3 patentsUS7378724B2May 27, 2008
Cavity structure for semiconductor structures
TAIWAN SEMICONDUCTOR MFG24 citations90
US7459386B2Dec 2, 2008
Method for forming solder bumps of increased height
TAIWAN SEMICONDUCTOR MFG14 citations79
US7456090B2Nov 25, 2008
Method to reduce UBM undercut
TAIWAN SEMICONDUCTOR MFG11 citations79