Inventor
KNAPP JAMES H
US23 patents
⚠️ This page may combine multiple inventors who share the name “KNAPP JAMES H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MOTOROLA INC
19 patentsUS5768456AJun 16, 1998
Optoelectronic package including photonic device mounted in flexible substrate
MOTOROLA INC169 citations98
US5973337AOct 26, 1999
Ball grid device with optically transmissive coating
MOTOROLA INC106 citations97
US5933558AAug 3, 1999
Optoelectronic device and method of assembly
MOTOROLA INC90 citations96
US5883996AMar 16, 1999
Electronic component for aligning a light transmitting structure
MOTOROLA INC59 citations96
US5468910ANov 21, 1995
Semiconductor device package and method of making
MOTOROLA INC71 citations96
US5118271AJun 2, 1992
Apparatus for encapsulating a semiconductor device
MOTOROLA INC57 citations96
US5834062ANov 10, 1998
Material transfer apparatus and method of using the same
MOTOROLA INC71 citations95
US5761364AJun 2, 1998
Optical waveguide
MOTOROLA INC56 citations94
US5319242AJun 7, 1994
Semiconductor package having an exposed die surface
MOTOROLA INC54 citations94
US6116791ASep 12, 2000
Optical coupler and method for coupling an optical fiber to an optoelectric device
MOTOROLA INC65 citations93
US5659648AAug 19, 1997
Polyimide optical waveguide having electrical conductivity
MOTOROLA INC38 citations92
US5900669AMay 4, 1999
Semiconductor component
MOTOROLA INC20 citations89
US5928595AJul 27, 1999
Method of manufacturing a semiconductor component
MOTOROLA INC32 citations88
US4975146ADec 4, 1990
Plasma removal of unwanted material
MOTOROLA INC9 citations73
US4877482AOct 31, 1989
Nitride removal method
MOTOROLA INC17 citations73
US4795077AJan 3, 1989
Bonding method and apparatus
MOTOROLA INC7 citations70
US5637264AJun 10, 1997
Method of fabricating an optical waveguide
MOTOROLA INC12 citations68
US5182071AJan 26, 1993
Method of molding a carrier ring to leads
MOTOROLA INC5 citations62
US5529682AJun 25, 1996
Method for making semiconductor devices having electroplated leads
MOTOROLA INC3 citations60
SEMICONDUCTOR COMPONENTS IND
4 patentsUS6300679B1Oct 9, 2001
Flexible substrate for packaging a semiconductor component
SEMICONDUCTOR COMPONENTS IND239 citations97
US6677672B2Jan 13, 2004
Structure and method of forming a multiple leadframe semiconductor device
SEMICONDUCTOR COMPONENTS IND48 citations94
US6081031AJun 27, 2000
Semiconductor package consisting of multiple conductive layers
SEMICONDUCTOR COMPONENTS IND27 citations92
US6833290B2Dec 21, 2004
Structure and method of forming a multiple leadframe semiconductor device
SEMICONDUCTOR COMPONENTS IND18 citations91