P

Inventor

KNAPP JAMES H

US23 patents
⚠️ This page may combine multiple inventors who share the name “KNAPP JAMES H”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MOTOROLA INC

19 patents
US5768456AJun 16, 1998

Optoelectronic package including photonic device mounted in flexible substrate

MOTOROLA INC169 citations98
US5973337AOct 26, 1999

Ball grid device with optically transmissive coating

MOTOROLA INC106 citations97
US5933558AAug 3, 1999

Optoelectronic device and method of assembly

MOTOROLA INC90 citations96
US5883996AMar 16, 1999

Electronic component for aligning a light transmitting structure

MOTOROLA INC59 citations96
US5468910ANov 21, 1995

Semiconductor device package and method of making

MOTOROLA INC71 citations96
US5118271AJun 2, 1992

Apparatus for encapsulating a semiconductor device

MOTOROLA INC57 citations96
US5834062ANov 10, 1998

Material transfer apparatus and method of using the same

MOTOROLA INC71 citations95
US5761364AJun 2, 1998

Optical waveguide

MOTOROLA INC56 citations94
US5319242AJun 7, 1994

Semiconductor package having an exposed die surface

MOTOROLA INC54 citations94
US6116791ASep 12, 2000

Optical coupler and method for coupling an optical fiber to an optoelectric device

MOTOROLA INC65 citations93
US5659648AAug 19, 1997

Polyimide optical waveguide having electrical conductivity

MOTOROLA INC38 citations92
US5900669AMay 4, 1999

Semiconductor component

MOTOROLA INC20 citations89
US5928595AJul 27, 1999

Method of manufacturing a semiconductor component

MOTOROLA INC32 citations88
US4975146ADec 4, 1990

Plasma removal of unwanted material

MOTOROLA INC9 citations73
US4877482AOct 31, 1989

Nitride removal method

MOTOROLA INC17 citations73
US4795077AJan 3, 1989

Bonding method and apparatus

MOTOROLA INC7 citations70
US5637264AJun 10, 1997

Method of fabricating an optical waveguide

MOTOROLA INC12 citations68
US5182071AJan 26, 1993

Method of molding a carrier ring to leads

MOTOROLA INC5 citations62
US5529682AJun 25, 1996

Method for making semiconductor devices having electroplated leads

MOTOROLA INC3 citations60

SEMICONDUCTOR COMPONENTS IND

4 patents