Inventor
WINSTEL KEVIN
US4 patents
Patents
4 patentsUS11458474B2Oct 4, 2022
Microfluidic chips with one or more vias
IBM3 citations69
US11462512B2Oct 4, 2022
Three-dimensional microelectronic package with embedded cooling channels
IBM0 citations61
US10937764B2Mar 2, 2021
Three-dimensional microelectronic package with embedded cooling channels
IBM1 citations61
US11322361B2May 3, 2022
Selective etching of silicon wafer
IBM0 citations45