Inventor

NAKATA HIROHIKO

JP68 patents

⚠️ This page may combine multiple inventors who share the name “NAKATA HIROHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

NAKATA HIROHIKO

SUMITOMO ELECTRIC INDUSTRIES

Temperature gauge and ceramic susceptor in which it is utilized

Heater module for semiconductor manufacturing equipment

Gas shower unit for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus

Copper circuit junction substrate and method of producing the same

Wafer holder for semiconductor manufacturing apparatus and semiconductor manufacturing apparatus using the same

Wafer holder for semiconductor manufacturing apparatus, method of manufacturing wafer holder, and semiconductor manufacturing apparatus

Power module board and power module using the board

Aluminum nitride sintered body and manufacturing method thereof

Ceramic heater for toner-fixing units and method for manufacturing the heater

Wafer holder for semiconductor manufacturing apparatus

Heater and heating/fixing unit comprising the same

Semiconductor heating apparatus

Circuit pattern of resistance heating elements and substrate-treating apparatus incorporating the pattern

Susceptor for semiconductor manufacturing equipment and process for producing the same

Aluminum nitride sintered body and method of preparing the same

Member for semiconductor device using an aluminum nitride substrate material, and method of manufacturing the same

Ceramics-metal jointed body

Wafer holder, and wafer prober provided therewith

Heater unit and semiconductor manufacturing apparatus including the same

Body for keeping a wafer and wafer prober using the same

Substrate processing apparatus

Ceramic joined body, substrate holding structure and substrate processing apparatus

Fluid heating heater

Workpiece holder for processing apparatus, and processing apparatus using the same

Ceramic heater for toner-fixing units and method for manufacturing the heater

Sintered aluminum nitride body and metallized substrate prepared therefrom

Ceramic susceptor for semiconductor manufacturing equipment

Wafer holder for semiconductor manufacturing apparatus, and method of manufacturing the wafer holder

Thermal fixing apparatus

High thermal conductivity composite material, and method for producing the same

Ceramic substrate and polishing method thereof

Aluminum nitride sintered body and method of preparing the same

Aluminum nitride heater

Heat fixing device for fixing a toner image

Semiconductor manufacturing apparatus

Aluminium nitride ceramics and method for preparing the same

Metallized ceramic substrate having smooth plating layer and method for producing the same

Aluminum nitride ceramics and method for preparing the same

Ceramic heater

Aluminum-nitride sintered body, method for fabricating the same, and semiconductor substrate comprising the same

Heating device for manufacturing semiconductor

Semiconductor processing apparatus with a heat resistant hermetically sealed substrate support

Semiconductor or liquid crystal producing device

Holder for use in semiconductor or liquid-crystal manufacturing device and semiconductor or liquid-crystal manufacturing device in which the holder is installed

Ceramic susceptor

Aluminum nitride sintered body

Wafer holder and semiconductor manufacturing apparatus

Connecting structures

UNIV OSAKA

Pressure self-combustion sintering method

FINE CERAMICS CENTER

Ceramics composite material and method of producing the same