P

Inventor

HAYATA SHIGERU

JP24 patents
⚠️ This page may combine multiple inventors who share the name “HAYATA SHIGERU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHINKAWA KK

19 patents
US6467673B2Oct 22, 2002

Bonding apparatus and bonding method

SHINKAWA KK27 citations92
US6464126B2Oct 15, 2002

Bonding apparatus and bonding method

SHINKAWA KK32 citations92
US6311391B1Nov 6, 2001

Flip-chip bonding apparatus

SHINKAWA KK45 citations89
US7886956B2Feb 15, 2011

Bonding apparatus and bonding stage height adjustment method for the bonding apparatus

SHINKAWA KK7 citations84
US6762848B2Jul 13, 2004

Offset measurement method, tool position detection method and bonding apparatus

SHINKAWA KK13 citations83
US10118246B2Nov 6, 2018

Mounting apparatus

SHINKAWA KK9 citations76
US6945446B2Sep 20, 2005

Wire bonding method and apparatus

SHINKAWA KK10 citations73
US6381359B1Apr 30, 2002

Bonding apparatus

SHINKAWA KK7 citations73
US10262968B2Apr 16, 2019

Wire bonding apparatus and wire bonding method

SHINKAWA KK2 citations72
US10586781B2Mar 10, 2020

Bonding apparatus and method of estimating position of landing point of bonding tool

SHINKAWA KK3 citations69
US6814121B2Nov 9, 2004

Bonding apparatus

SHINKAWA KK4 citations62
US6683731B2Jan 27, 2004

Bonding apparatus

SHINKAWA KK2 citations62
US6657799B2Dec 2, 2003

Wire bonding apparatus

SHINKAWA KK6 citations62
US12374650B2Jul 29, 2025

Manufacturing apparatus and manufacturing method of semiconductor device

SHINKAWA KK0 citations52
US12261148B2Mar 25, 2025

Wire bonding apparatus

SHINKAWA KK0 citations52
US12057427B2Aug 6, 2024

Wire bonding apparatus

SHINKAWA KK0 citations52
US7848022B2Dec 7, 2010

Imaging device and method for a bonding apparatus

SHINKAWA KK1 citations52
US11367703B2Jun 21, 2022

Bonding apparatus

SHINKAWA KK0 citations45
US10816322B2Oct 27, 2020

Bonding apparatus and method for detecting height of bonding target

SHINKAWA KK0 citations40

CANON KK

5 patents