P

Inventor

YIN GERALD ZHEYAO

US41 patents
⚠️ This page may combine multiple inventors who share the name “YIN GERALD ZHEYAO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

APPLIED MATERIALS INC

35 patents
US6528751B1Mar 4, 2003

Plasma reactor with overhead RF electrode tuned to the plasma

APPLIED MATERIALS INC266 citations99
US6120640ASep 19, 2000

Boron carbide parts and coatings in a plasma reactor

APPLIED MATERIALS INC348 citations99
US5730801AMar 24, 1998

Compartnetalized substrate processing chamber

APPLIED MATERIALS INC836 citations99
US5710486AJan 20, 1998

Inductively and multi-capacitively coupled plasma reactor

APPLIED MATERIALS INC139 citations99
US7030335B2Apr 18, 2006

Plasma reactor with overhead RF electrode tuned to the plasma with arcing suppression

APPLIED MATERIALS INC72 citations98
US6699399B1Mar 2, 2004

Self-cleaning etch process

APPLIED MATERIALS INC500 citations98
US6518195B1Feb 11, 2003

Plasma reactor using inductive RF coupling, and processes

APPLIED MATERIALS INC162 citations98
US6189484B1Feb 20, 2001

Plasma reactor having a helicon wave high density plasma source

APPLIED MATERIALS INC116 citations98
US6136211AOct 24, 2000

Self-cleaning etch process

APPLIED MATERIALS INC160 citations98
US5885358AMar 23, 1999

Gas injection slit nozzle for a plasma process reactor

APPLIED MATERIALS INC203 citations98
US5756400AMay 26, 1998

Method and apparatus for cleaning by-products from plasma chamber surfaces

APPLIED MATERIALS INC407 citations98
US5746875AMay 5, 1998

Gas injection slit nozzle for a plasma process reactor

APPLIED MATERIALS INC169 citations98
US5643394AJul 1, 1997

Gas injection slit nozzle for a plasma process reactor

APPLIED MATERIALS INC215 citations98
US6949203B2Sep 27, 2005

System level in-situ integrated dielectric etch process particularly useful for copper dual damascene

APPLIED MATERIALS INC69 citations97
US6488807B1Dec 3, 2002

Magnetic confinement in a plasma reactor having an RF bias electrode

APPLIED MATERIALS INC145 citations97
US6387287B1May 14, 2002

Process for etching oxide using a hexafluorobutadiene and manifesting a wide process window

APPLIED MATERIALS INC94 citations97
US6379575B1Apr 30, 2002

Treatment of etching chambers using activated cleaning gas

APPLIED MATERIALS INC375 citations97
US6251792B1Jun 26, 2001

Plasma etch processes

APPLIED MATERIALS INC122 citations97
US5900062AMay 4, 1999

Lift pin for dechucking substrates

APPLIED MATERIALS INC102 citations97
US6218312B1Apr 17, 2001

Plasma reactor with heated source of a polymer-hardening precursor material

APPLIED MATERIALS INC61 citations96
US6030486AFeb 29, 2000

Magnetically confined plasma reactor for processing a semiconductor wafer

APPLIED MATERIALS INC55 citations96
US6020686AFeb 1, 2000

Inductively and multi-capacitively coupled plasma reactor

APPLIED MATERIALS INC52 citations96
US5897712AApr 27, 1999

Plasma uniformity control for an inductive plasma source

APPLIED MATERIALS INC63 citations96
US5891348AApr 6, 1999

Process gas focusing apparatus and method

APPLIED MATERIALS INC61 citations96
US5883017AMar 16, 1999

Compartmentalized substrate processing chamber

APPLIED MATERIALS INC73 citations96
US5817534AOct 6, 1998

RF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafers

APPLIED MATERIALS INC94 citations96
US5753044AMay 19, 1998

RF plasma reactor with hybrid conductor and multi-radius dome ceiling

APPLIED MATERIALS INC91 citations95
US5783101AJul 21, 1998

High etch rate residue free metal etch process with low frequency high power inductive coupled plasma

APPLIED MATERIALS INC21 citations93
US6500357B1Dec 31, 2002

System level in-situ integrated dielectric etch process particularly useful for copper dual damascene

APPLIED MATERIALS INC38 citations92
US6440866B1Aug 27, 2002

Plasma reactor with heated source of a polymer-hardening precursor material

APPLIED MATERIALS INC22 citations92
US6036877AMar 14, 2000

Plasma reactor with heated source of a polymer-hardening precursor material

APPLIED MATERIALS INC30 citations92
US5965463AOct 12, 1999

Silane etching process

APPLIED MATERIALS INC44 citations92
US5777289AJul 7, 1998

RF plasma reactor with hybrid conductor and multi-radius dome ceiling

APPLIED MATERIALS INC35 citations92
US6270687B1Aug 7, 2001

RF plasma method

APPLIED MATERIALS INC42 citations91
US6248250B1Jun 19, 2001

RF plasma reactor with hybrid conductor and multi-radius dome ceiling

APPLIED MATERIALS INC29 citations91

(unassigned)

2 patents

ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA

2 patents

HOFFMAN DANIEL J

1 patent

LIU ZHONGDU

1 patent