Inventor
OSTERNAUD BENEDITE
FR9 patents
Patents
9 patentsUS7018910B2Mar 28, 2006
Transfer of a thin layer from a wafer comprising a buffer layer
SOITEC SILICON ON INSULATOR30 citations92
US6991956B2Jan 31, 2006
Methods for transferring a thin layer from a wafer having a buffer layer
SOITEC SILICON ON INSULATOR23 citations92
US7008857B2Mar 7, 2006
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
SOITEC SILICON ON INSULATOR16 citations91
US7256075B2Aug 14, 2007
Recycling of a wafer comprising a multi-layer structure after taking-off a thin layer
SOITEC SILICON ON INSULATOR20 citations83
US7375008B2May 20, 2008
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
SOITEC SILICON ON INSULATOR6 citations73
US6908774B2Jun 21, 2005
Method and apparatus for adjusting the thickness of a thin layer of semiconductor material
SOITEC SILICON ON INSULATOR9 citations73
US7602046B2Oct 13, 2009
Recycling by mechanical means of a wafer comprising a multilayer structure after taking-off a thin layer thereof
SOITEC SILICON ON INSULATOR4 citations62
US7033905B2Apr 25, 2006
Recycling of a wafer comprising a buffer layer after having separated a thin layer therefrom by mechanical means
SOITEC SILICON ON INSULATOR5 citations61
US7378729B2May 27, 2008
Recycling a wafer comprising a buffer layer, after having separated a thin layer therefrom
SOITEC SILICON ON INSULATOR0 citations51