Inventor

YANG JOUNGLN

KR3 patents

⚠️ This page may combine multiple inventors who share the name “YANG JOUNGLN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

PARK YISU

1 patent

US8723310B2May 13, 2014

Integrated circuit packaging system having warpage prevention structures

PARK YISU8 citations77

STATS CHIPPAC LTD

1 patent

US7863100B2Jan 4, 2011

Integrated circuit packaging system with layered packaging and method of manufacture thereof

STATS CHIPPAC LTD3 citations60

PARK DONGSAM

1 patent

US8334601B2Dec 18, 2012

Package-on-package system with through vias and method of manufacture thereof

PARK DONGSAM2 citations58