Inventor
ICHIKAWA KEITARO
JP9 patents
Patents
9 patentsUS9627302B2Apr 18, 2017
Power semiconductor device
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US12444666B2Oct 14, 2025
Semiconductor device with bent terminals
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US11652032B2May 16, 2023
Semiconductor device having inner lead exposed from sealing resin, semiconductor device manufacturing method thereof, and power converter including the semiconductor device
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US10930523B2Feb 23, 2021
Method for manufacturing resin-sealed power semiconductor device
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US12211764B2Jan 28, 2025
Semiconductor device and method of manufacturing the same
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US11244836B2Feb 8, 2022
Semiconductor apparatus, power conversion device, and method for manufacturing semiconductor apparatus
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US11735509B2Aug 22, 2023
Power semiconductor device and manufacturing method thereof
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US11335629B2May 17, 2022
Transfer-mold type power module and lead frame
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US10074598B2Sep 11, 2018
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP0 citations40