Inventor
HEO JUNYEONG
KR13 patents
⚠️ This page may combine multiple inventors who share the name “HEO JUNYEONG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SAMSUNG ELECTRONICS CO LTD
12 patentsUS11424172B2Aug 23, 2022
Semiconductor package
SAMSUNG ELECTRONICS CO LTD6 citations83
US11869821B2Jan 9, 2024
Semiconductor package having molding layer with inclined side wall
SAMSUNG ELECTRONICS CO LTD4 citations72
US11239171B2Feb 1, 2022
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD1 citations71
US11996367B2May 28, 2024
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US11721669B2Aug 8, 2023
Semiconductor package including a first semiconductor stack and a second semiconductor stack of different widths
SAMSUNG ELECTRONICS CO LTD1 citations61
US11694963B2Jul 4, 2023
Semiconductor device and semiconductor package including the same
SAMSUNG ELECTRONICS CO LTD0 citations61
US12094794B2Sep 17, 2024
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11935832B2Mar 19, 2024
Semiconductor device and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11515226B2Nov 29, 2022
Semiconductor package and method of fabricating the same
SAMSUNG ELECTRONICS CO LTD0 citations60
US11469180B2Oct 11, 2022
Semiconductor device including an insulating material layer with concave-convex portions
SAMSUNG ELECTRONICS CO LTD1 citations60
US12406888B2Sep 2, 2025
Semiconductor substrate and method of dicing the same
SAMSUNG ELECTRONICS CO LTD0 citations50
US12355004B2Jul 8, 2025
Semiconductor chip and semiconductor package
SAMSUNG ELECTRONICS CO LTD0 citations50