Inventor
KANEKO HISASHI
JP85 patents
⚠️ This page may combine multiple inventors who share the name “KANEKO HISASHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOSHIBA KK
38 patentsUS6071810AJun 6, 2000
Method of filling contact holes and wiring grooves of a semiconductor device
TOSHIBA KK101 citations99
US6563308B2May 13, 2003
Eddy current loss measuring sensor, thickness measuring system, thickness measuring method, and recorded medium
TOSHIBA KK144 citations98
US6375823B1Apr 23, 2002
Plating method and plating apparatus
TOSHIBA KK96 citations98
US6348402B1Feb 19, 2002
Method of manufacturing a copper interconnect
TOSHIBA KK87 citations98
US6229211B1May 8, 2001
Semiconductor device and method of manufacturing the same
TOSHIBA KK88 citations98
US5953634ASep 14, 1999
Method of manufacturing semiconductor device
TOSHIBA KK103 citations98
US5770095AJun 23, 1998
Polishing agent and polishing method using the same
TOSHIBA KK413 citations98
US6727593B2Apr 27, 2004
Semiconductor device with improved bonding
TOSHIBA KK48 citations96
US6673704B2Jan 6, 2004
Semiconductor device and method of manufacturing the same
TOSHIBA KK42 citations96
US6403481B1Jun 11, 2002
Film formation method
TOSHIBA KK55 citations96
US6306756B1Oct 23, 2001
Method for production of semiconductor device
TOSHIBA KK62 citations96
US6291891B1Sep 18, 2001
Semiconductor device manufacturing method and semiconductor device
TOSHIBA KK69 citations96
US6150270ANov 21, 2000
Method for forming barrier layer for copper metallization
TOSHIBA KK54 citations96
US6090701AJul 18, 2000
Method for production of semiconductor device
TOSHIBA KK74 citations96
US5664989ASep 9, 1997
Polishing pad, polishing apparatus and polishing method
TOSHIBA KK74 citations96
US5409862AApr 25, 1995
Method for making aluminum single crystal interconnections on insulators
TOSHIBA KK56 citations96
US7921401B2Apr 5, 2011
Stress analysis method, wiring structure design method, program, and semiconductor device production method
TOSHIBA KK35 citations93
US6913681B2Jul 5, 2005
Plating method and plating apparatus
TOSHIBA KK20 citations93
US6670714B1Dec 30, 2003
Semiconductor integrated circuit device having multilevel interconnection
TOSHIBA KK22 citations93
US6611060B1Aug 26, 2003
Semiconductor device having a damascene type wiring layer
TOSHIBA KK26 citations93
US6579785B2Jun 17, 2003
Method of making multi-level wiring in a semiconductor device
TOSHIBA KK31 citations93
US6342444B1Jan 29, 2002
Method of forming diffusion barrier for copper interconnects
TOSHIBA KK32 citations93
US5661345AAug 26, 1997
Semiconductor device having a single-crystal metal wiring
TOSHIBA KK35 citations93
US6555925B1Apr 29, 2003
Semiconductor device and producing method thereof
TOSHIBA KK33 citations92
US6552434B2Apr 22, 2003
Semiconductor device and manufacturing method thereof
TOSHIBA KK18 citations92
US6518177B1Feb 11, 2003
Method of manufacturing a semiconductor device
TOSHIBA KK23 citations92
US6403462B1Jun 11, 2002
Method for manufacturing high reliability interconnection having diffusion barrier layer
TOSHIBA KK16 citations92
US6368951B2Apr 9, 2002
Semiconductor device manufacturing method and semiconductor device
TOSHIBA KK16 citations92
US6054770AApr 25, 2000
Electric solid state device and method for manufacturing the device
TOSHIBA KK35 citations92
US6001461ADec 14, 1999
Electronic parts and manufacturing method thereof
TOSHIBA KK44 citations92
US5709958AJan 20, 1998
Electronic parts
TOSHIBA KK48 citations92
US5629236AMay 13, 1997
Method of manufacture of semiconductor device
TOSHIBA KK40 citations92
US5187561AFeb 16, 1993
Metal single crystal line having a particular crystal orientation
TOSHIBA KK21 citations92
US6407453B1Jun 18, 2002
Semiconductor device and method of manufacturing the same
TOSHIBA KK32 citations90
US7996813B2Aug 9, 2011
Method for generating pattern, method for manufacturing semiconductor device, semiconductor device, and computer program
TOSHIBA KK9 citations84
US7635646B2Dec 22, 2009
Method for fabricating semiconductor device
TOSHIBA KK12 citations84
US7238919B2Jul 3, 2007
Heating element movement bonding method for semiconductor components
TOSHIBA KK13 citations84
US7214305B2May 8, 2007
Method of manufacturing electronic device
TOSHIBA KK12 citations84
FUJITSU LTD
9 patentsUS5590001ADec 31, 1996
Breather filter unit for magnetic disk drive
FUJITSU LTD52 citations95
US6678112B1Jan 13, 2004
Disk drive device
FUJITSU LTD41 citations93
US5956210ASep 21, 1999
Structure and jig for mounting spring arm on corresponding head arm
FUJITSU LTD24 citations93
US6992864B2Jan 31, 2006
Flexible printed circuit board unit contributing to reliable soldering and suppression of increased temperature
FUJITSU LTD29 citations92
US5798887AAug 25, 1998
Apparatus for absorbing stator vibrations in computer storage apparatus
FUJITSU LTD40 citations92
US5859746AJan 12, 1999
Magnetic disk drive and flexible printed board used in such drive
FUJITSU LTD21 citations91
US5583720ADec 10, 1996
Magnetic disk drive and flexible printed board used in such drive
FUJITSU LTD33 citations91
US7554762B2Jun 30, 2009
Recording disk drive having shroud
FUJITSU LTD13 citations84
US6633450B1Oct 14, 2003
Method of and apparatus for controlling disk drive
FUJITSU LTD14 citations84
EBARA CORP
2 patentsIBIDEN CO LTD
1 patentShowing the top 50 of 85 patents by PatentIndex Score.