Inventor

MANABE HIDEKAZU

JP5 patents

⚠️ This page may combine multiple inventors who share the name “MANABE HIDEKAZU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

2 patents

US5950687ASep 14, 1999

Lead forming apparatus and lead forming method

MITSUBISHI ELECTRIC CORP7 citations71

US6363976B1Apr 2, 2002

Semiconductor manufacturing apparatus and method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP8 citations69

RENESAS TECH CORP

1 patent

US6925922B2Aug 9, 2005

Apparatus for removing tiebars after molding of semiconductor chip

RENESAS TECH CORP38 citations89

RENESAS DEVICE DESIGN CORP

1 patent

US7077170B2Jul 18, 2006

Method of forming leads of a semiconductor device

RENESAS DEVICE DESIGN CORP2 citations56

TOYOTA MOTOR CO LTD

1 patent

US7185425B2Mar 6, 2007

Method for connecting printed circuit boards

TOYOTA MOTOR CO LTD0 citations45