Inventor
VAN DYK SOEREWYN HERMAN F
US5 patents
Patents
5 patentsUS4626478ADec 2, 1986
Electronic circuit device components having integral spacers providing uniform thickness bonding film
UNITRODE CORP30 citations89
US4538168AAug 27, 1985
High power semiconductor package
UNITRODE CORP22 citations79
US4514587AApr 30, 1985
High power semiconductor package
UNITRODE CORP22 citations79
US4536825AAug 20, 1985
Leadframe having severable fingers for aligning one or more electronic circuit device components
UNITRODE CORP9 citations70
US4443655AApr 17, 1984
Extruded semiconductor package and fabrication method
UNITRODE CORP8 citations70