Inventor
TAN LIP SENG
SG2 patents
Patents
2 patentsUS7986032B2Jul 26, 2011
Semiconductor package system with substrate having different bondable heights at lead finger tips
STATS CHIPPAC LTD7 citations82
US7598599B2Oct 6, 2009
Semiconductor package system with substrate having different bondable heights at lead finger tips
STATS CHIPPAC LTD10 citations82