Inventor
WEBB M CLAIR
US11 patents
⚠️ This page may combine multiple inventors who share the name “WEBB M CLAIR”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
8 patentsUS9685436B2Jun 20, 2017
Monolithic three-dimensional (3D) ICs with local inter-level interconnects
INTEL CORP24 citations94
US10297592B2May 21, 2019
Monolithic three-dimensional (3D) ICs with local inter-level interconnects
INTEL CORP9 citations84
US10068874B2Sep 4, 2018
Method for direct integration of memory die to logic die without use of thru silicon vias (TSV)
INTEL CORP15 citations84
US10700039B2Jun 30, 2020
Silicon die with integrated high voltage devices
INTEL CORP5 citations73
US11271010B2Mar 8, 2022
Multi version library cell handling and integrated circuit structures fabricated therefrom
INTEL CORP2 citations72
US12067338B2Aug 20, 2024
Multi version library cell handling and integrated circuit structures fabricated therefrom
INTEL CORP0 citations61
US9721898B2Aug 1, 2017
Methods of forming under device interconnect structures
INTEL CORP0 citations48
US9490201B2Nov 8, 2016
Methods of forming under device interconnect structures
INTEL CORP0 citations48