Inventor
HUANG KUAN-CHIEH
TW66 patents
⚠️ This page may combine multiple inventors who share the name “HUANG KUAN-CHIEH”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
28 patentsUS9972603B2May 15, 2018
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations93
US10510592B2Dec 17, 2019
Integrated circuit (IC) structure for high performance and functional density
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10777539B2Sep 15, 2020
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD9 citations83
US12507490B2Dec 23, 2025
Semiconductor device including germanium region disposed in semiconductor substrate
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations74
US11222814B2Jan 11, 2022
Integrated circuit (IC) structure for high performance and functional density
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US9570431B1Feb 14, 2017
Semiconductor wafer for integrated packages
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US12015099B2Jun 18, 2024
Semiconductor sensor and methods thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11855237B2Dec 26, 2023
Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US10475772B2Nov 12, 2019
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US10157895B2Dec 18, 2018
Seal-ring structure for stacking integrated circuits
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12495632B2Dec 9, 2025
Semiconductor image sensor and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations63
US11387167B2Jul 12, 2022
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US11217478B2Jan 4, 2022
Integrated circuit (IC) structure for high performance and functional density
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12396289B2Aug 19, 2025
Germanium-containing photodetector and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12363969B2Jul 15, 2025
Passivation layer for epitaxial semiconductor process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12166054B2Dec 10, 2024
Image sensor with passivation layer for dark current reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12148853B2Nov 19, 2024
Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12125934B2Oct 22, 2024
Method of manufacturing an optical sensor
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12051763B2Jul 30, 2024
Germanium-containing photodetector and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11908900B2Feb 20, 2024
Passivation layer for epitaxial semiconductor process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11848345B2Dec 19, 2023
Image sensor with passivation layer for dark current reduction
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11600737B2Mar 7, 2023
Germanium-based sensor with junction-gate field effect transistor and method of fabricating thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11508817B2Nov 22, 2022
Passivation layer for epitaxial semiconductor process
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901393B2Feb 13, 2024
Image sensor and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations61
US12581764B2Mar 17, 2026
Bond structure having shielding structures for stacked IC chips
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US10727164B2Jul 28, 2020
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10163758B1Dec 25, 2018
Semiconductor structure and manufacturing method for the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US11837613B2Dec 5, 2023
Germanium-containing photodetector and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51
GENESIS PHOTONICS INC
13 patentsUSD731989SJun 16, 2015
Light emitting diode chip
GENESIS PHOTONICS INC15 citations92
USD763805SAug 16, 2016
Light emitting diode chip
GENESIS PHOTONICS INC13 citations84
US9859459B2Jan 2, 2018
Method for manufacturing light emitting unit
GENESIS PHOTONICS INC4 citations82
US10608144B2Mar 31, 2020
Electrode pad structure of a light emitting diode
GENESIS PHOTONICS INC3 citations71
US9705045B2Jul 11, 2017
Light emitting diode having distributed bragg reflectors (DBR) and manufacturing method thereof
GENESIS PHOTONICS INC3 citations71
US9356205B2May 31, 2016
Light emitting component
GENESIS PHOTONICS INC2 citations63
US9219211B1Dec 22, 2015
Method for manufacturing light emitting unit
GENESIS PHOTONICS INC3 citations61
US10734551B2Aug 4, 2020
Light emitting diode
GENESIS PHOTONICS INC1 citations59
US10453999B2Oct 22, 2019
Light emitting diode
GENESIS PHOTONICS INC1 citations59
US10396255B2Aug 27, 2019
Light emitting component
GENESIS PHOTONICS INC0 citations52
US9831399B2Nov 28, 2017
Light emitting component
GENESIS PHOTONICS INC0 citations52
US9236542B1Jan 12, 2016
Light emitting element structure
GENESIS PHOTONICS INC0 citations52
US9175819B2Nov 3, 2015
Light-emitting device with graphene enhanced thermal properties and secondary wavelength converting light shade
GENESIS PHOTONICS INC0 citations52
HUANG KUAN-CHIEH
4 patentsUS8247262B2Aug 21, 2012
Method for reducing contact resistance of CMOS image sensor
HUANG KUAN-CHIEH65 citations97
US8586404B2Nov 19, 2013
Method for reducing contact resistance of CMOS image sensor
HUANG KUAN-CHIEH15 citations92
US8674469B2Mar 18, 2014
Isolation structure for backside illuminated image sensor
HUANG KUAN-CHIEH7 citations83
US8791541B2Jul 29, 2014
Backside-illuminated image sensor having a supporting substrate
HUANG KUAN-CHIEH2 citations62
TAIWAN SEMICONDUCTOR MFG
3 patentsUS9257326B2Feb 9, 2016
Method of making backside illuminated image sensors
TAIWAN SEMICONDUCTOR MFG0 citations52
US8952474B2Feb 10, 2015
Method of fabricating backside-illuminated image sensor
TAIWAN SEMICONDUCTOR MFG0 citations52
US8946847B2Feb 3, 2015
Backside illuminated image sensors and method of making the same
TAIWAN SEMICONDUCTOR MFG0 citations52
MOSEL VITELIC INC
1 patentWU CHIH-JEN
1 patentShowing the top 50 of 66 patents by PatentIndex Score.