Inventor

GAKU MORIO

JP47 patents

Patents

47 patents

US6280641B1Aug 28, 2001

Printed wiring board having highly reliably via hole and process for forming via hole

MITSUBISHI GAS CHEMICAL CO147 citations98

US6097089AAug 1, 2000

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

MITSUBISHI GAS CHEMICAL CO121 citations98

US6720651B2Apr 13, 2004

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

MITSUBISHI GAS CHEMICAL CO28 citations93

US6265767B1Jul 24, 2001

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

MITSUBISHI GAS CHEMICAL CO44 citations93

US4917758AApr 17, 1990

Method for preparing thin copper foil-clad substrate for circuit boards

MITSUBISHI GAS CHEMICAL CO61 citations93

US4371689AFeb 1, 1983

Curable resin composition comprising cyanate ester and acrylic alkenyl ester

MITSUBISHI GAS CHEMICAL CO43 citations93

US4370467AJan 25, 1983

Curable resin composition from polyfunctional aromatic ester and maleimide compound

MITSUBISHI GAS CHEMICAL CO37 citations93

US6736988B1May 18, 2004

Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board

MITSUBISHI GAS CHEMICAL CO31 citations92

US5082402AJan 21, 1992

Method of drilling of through-holes in printed circuit board panels

MITSUBISHI GAS CHEMICAL CO50 citations92

US4937132AJun 26, 1990

Laminating material for printed circuit board of low dielectric constant

MITSUBISHI GAS CHEMICAL CO35 citations92

US4871811AOct 3, 1989

Hot melt adhesive composition

MITSUBISHI GAS CHEMICAL CO40 citations92

US4393195AJul 12, 1983

Curable cyanate ester/acrylic epoxy ester composition

MITSUBISHI GAS CHEMICAL CO44 citations92

US4904760AFeb 27, 1990

Thermosetting resin composition from cyanate ester and non-branched aromatic compound

MITSUBISHI GAS CHEMICAL CO57 citations91

US4780507AOct 25, 1988

Curable thermosetting cyanate ester composition

MITSUBISHI GAS CHEMICAL CO38 citations91

US4740343AApr 26, 1988

Method for producing rigid resin molds

MITSUBISHI GAS CHEMICAL CO37 citations91

US4383903AMay 17, 1983

Curable resin composition

MITSUBISHI GAS CHEMICAL CO55 citations91

US4287014ASep 1, 1981

Novel crosslinkable resin composition and method for producing a laminate using said composition

MITSUBISHI GAS CHEMICAL CO44 citations91

US6708404B1Mar 23, 2004

Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole

MITSUBISHI GAS CHEMICAL CO33 citations90

US3962184AJun 8, 1976

Process for preparing cured resin from cyanic acid esters using imidazole catalysts

MITSUBISHI GAS CHEMICAL CO36 citations90

US3932250AJan 13, 1976

Method for manufacturing metal foil- or plastic film-overlaid laminate

MITSUBISHI GAS CHEMICAL CO46 citations89

US4396679AAug 2, 1983

Plastic articles suitable for electroless plating

MITSUBISHI GAS CHEMICAL CO30 citations86

US4645805AFeb 24, 1987

Adhesive composition and adhesive film or sheet on which the composition is coated

MITSUBISHI GAS CHEMICAL CO20 citations82

US4469859ASep 4, 1984

Curable resin composition comprising cyanate ester and cyclopentadiene

MITSUBISHI GAS CHEMICAL CO19 citations82

US4369304AJan 18, 1983

Curable resin composition of (1) polyfunctional cyanate ester, (2) acrylic or methacrylic ester and (3) maleimide

MITSUBISHI GAS CHEMICAL CO27 citations82

US7140103B2Nov 28, 2006

Process for the production of high-density printed wiring board

MITSUBISHI GAS CHEMICAL CO13 citations81

US5186880AFeb 16, 1993

Process for producing cyanate ester resin cure product

MITSUBISHI GAS CHEMICAL CO19 citations81

US4820769AApr 11, 1989

Hot melt adhesive composition

MITSUBISHI GAS CHEMICAL CO21 citations81

US4554346ANov 19, 1985

Preparation of curable resin from cyanate ester compound

MITSUBISHI GAS CHEMICAL CO24 citations81

US4533727AAug 6, 1985

Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound

MITSUBISHI GAS CHEMICAL CO22 citations81

US3987230AOct 19, 1976

Laminates and process for production thereof

MITSUBISHI GAS CHEMICAL CO21 citations81

US6750422B2Jun 15, 2004

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

MITSUBISHI GAS CHEMICAL CO8 citations74

US4820855AApr 11, 1989

Process for producing polyfunctional cyanate ester polymer

MITSUBISHI GAS CHEMICAL CO7 citations74

US4717609AJan 5, 1988

Adhesive composition and adhesive film or sheet on which the composition is coated

MITSUBISHI GAS CHEMICAL CO13 citations74

US5160787ANov 3, 1992

Electrical laminate having ability to absorb ultraviolet rays

MITSUBISHI GAS CHEMICAL CO16 citations72

US4585855AApr 29, 1986

Process for producing curable resin composition from cyanate ester and maleimide/diamine reaction product

MITSUBISHI GAS CHEMICAL CO14 citations72

US6229096B1May 8, 2001

Nonwoven reinforcement for printed wiring base board and process for producing the same

MITSUBISHI GAS CHEMICAL CO7 citations71

US5076864ADec 31, 1991

Process for producing multilayer printed wiring board

MITSUBISHI GAS CHEMICAL CO12 citations69

US4785034ANov 15, 1988

Polyolefin resin composition

MITSUBISHI GAS CHEMICAL CO18 citations69

US4429112AJan 31, 1984

Process of delaying cure of curable resin composition containing cyanate ester compound with benzene sulfonic acid compound

MITSUBISHI GAS CHEMICAL CO15 citations68

US4410601AOct 18, 1983

Colloidal solutions, processes for producing the same and uses thereof

MITSUBISHI GAS CHEMICAL CO4 citations63

US7989081B2Aug 2, 2011

Resin composite copper foil, printed wiring board, and production processes thereof

MITSUBISHI GAS CHEMICAL CO5 citations62

US8377544B2Feb 19, 2013

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

MITSUBISHI GAS CHEMICAL CO1 citations51

GAKU MORIO

Patents

Printed wiring board having highly reliably via hole and process for forming via hole

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

Semiconductor plastic package and process for the production thereof

Semiconductor plastic package and process for the production thereof

Curable resin compositions of cyanate esters

Cyanic acid esters of aromatic polycarbonates

Semiconductor package including heat diffusion portion

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

Method for preparing thin copper foil-clad substrate for circuit boards

Curable resin composition comprising cyanate ester and acrylic alkenyl ester

Curable resin composition from polyfunctional aromatic ester and maleimide compound

Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board

Method of drilling of through-holes in printed circuit board panels

Laminating material for printed circuit board of low dielectric constant

Hot melt adhesive composition

Curable cyanate ester/acrylic epoxy ester composition

Thermosetting resin composition from cyanate ester and non-branched aromatic compound

Curable thermosetting cyanate ester composition

Method for producing rigid resin molds

Curable resin composition

Novel crosslinkable resin composition and method for producing a laminate using said composition

Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole

Process for preparing cured resin from cyanic acid esters using imidazole catalysts

Method for manufacturing metal foil- or plastic film-overlaid laminate

Plastic articles suitable for electroless plating

Adhesive composition and adhesive film or sheet on which the composition is coated

Curable resin composition comprising cyanate ester and cyclopentadiene

Curable resin composition of (1) polyfunctional cyanate ester, (2) acrylic or methacrylic ester and (3) maleimide

Process for the production of high-density printed wiring board

Process for producing cyanate ester resin cure product

Hot melt adhesive composition

Preparation of curable resin from cyanate ester compound

Process for producing a curable resin from cyanate ester compound and unsaturated 1,2-epoxy compound

Laminates and process for production thereof

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Process for producing polyfunctional cyanate ester polymer

Adhesive composition and adhesive film or sheet on which the composition is coated

Electrical laminate having ability to absorb ultraviolet rays

Process for producing curable resin composition from cyanate ester and maleimide/diamine reaction product

Nonwoven reinforcement for printed wiring base board and process for producing the same

Process for producing multilayer printed wiring board

Polyolefin resin composition

Process of delaying cure of curable resin composition containing cyanate ester compound with benzene sulfonic acid compound

Colloidal solutions, processes for producing the same and uses thereof

Resin composite copper foil, printed wiring board, and production processes thereof

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity