Inventor

IKEGUCHI NOBUYUKI

JP46 patents

⚠️ This page may combine multiple inventors who share the name “IKEGUCHI NOBUYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IKEGUCHI NOBUYUKI

MITSUBISHI GAS CHEMICAL CO

Printed wiring board having highly reliably via hole and process for forming via hole

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

Semiconductor plastic package and process for the production thereof

Ball grid array type printed wiring board having exellent heat diffusibility and printed wiring board

Semiconductor plastic package and process for the production thereof

Printed wiring board for semiconductor plastic package

Semiconductor package including heat diffusion portion

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Semiconductor plastic package, metal plate for said package, and method of producing copper-clad board for said package

Curable resin composition

Curable resin composition comprising cyanate ester and acrylic alkenyl ester

Curable resin composition from polyfunctional aromatic ester and maleimide compound

Copper-clad board suitable for making hole with carbon dioxide laser, method of making hole in said copper-clad board and printed wiring board comprising said copper-clad board

Printed wiring board for semiconductor plastic package

Electrically conductive resin composition

Curable cyanate ester/acrylic epoxy ester composition

High relative-permittivity B-staged sheet, high relative-permittivity prepreg, its production process, and printed wiring board comprising any one of these

Curable resin composition

Method of producing high-density copper clad multi-layered printed wiring board having highly reliable through hole

Curable resin composition

Heat-resistant film base-material-inserted B-stage resin composition sheet for lamination and use thereof

Plastic articles suitable for electroless plating

Resist composition excellent in flame resistance

Adhesive composition and adhesive film or sheet on which the composition is coated

Curable resin composition comprising cyanate ester and cyclopentadiene

Curable resin composition

Curable resin composition from cyanate ester and acrylic ester

Curable resin composition of (1) polyfunctional cyanate ester, (2) acrylic or methacrylic ester and (3) maleimide

Curable resin composition

Curable resin composition comprising cyanate ester and polyisocyanate

Method of making through hole with laser, copper-clad laminate suitable for making hole, and auxiliary material for making hole

Adhesive composition and adhesive film or sheet on which the composition is coated

Curable resin composition

Curable resin composition

Curable resin composition

Colloidal solutions, processes for producing the same and uses thereof

Curable resin composition

Photosensitive resin composition

Coating method

Glass fabric base material/thermosetting resin copper-clad laminate having a high-elasticity

SAMSUNG ELECTRO MECH

Semiconductor plastic package and fabricating method thereof

Method of manufacturing semiconductor package and semiconductor plastic package using the same

IKEGUCHI NOBUYUKI

Lubricant sheet for drilling and method of drilling

Method of manufacturing semiconductor package having a first board, second boards electrically connected to both sides of the first board, and at least one component connected to the first board by a flip chip method

SHIN JOON-SIK

Method of fabricating semiconductor plastic package including a core board, build-up insulation layer, printed circuit, and semiconductor chip

SOHN KEUNGJIN

Method of manufacturing and insulating sheet