Inventor
KATAYAMA ICHIRO
JP21 patents
⚠️ This page may combine multiple inventors who share the name “KATAYAMA ICHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO SEIMITSU CO LTD
7 patentsUS6267648B1Jul 31, 2001
Apparatus and method for chamfering wafer
TOKYO SEIMITSU CO LTD152 citations96
US6431961B1Aug 13, 2002
Apparatus and method for chamfering wafer
TOKYO SEIMITSU CO LTD16 citations90
US6067976AMay 30, 2000
Wafer cut method with wire saw apparatus and apparatus thereof
TOKYO SEIMITSU CO LTD18 citations83
US5769695AJun 23, 1998
Chamfer grinding system for wafer
TOKYO SEIMITSU CO LTD9 citations74
US5074276ADec 24, 1991
Slicing method by a slicing machine
TOKYO SEIMITSU CO LTD14 citations74
US5287843AFeb 22, 1994
Slicing machine employing an axial force to provide rigidity to a rotary blade
TOKYO SEIMITSU CO LTD12 citations71
US5174270ADec 29, 1992
Slicing machine and a slicing method by the same
TOKYO SEIMITSU CO LTD11 citations71
(unassigned)
4 patentsUS6029544AFeb 29, 2000
Sintered diamond drill bits and method of making
150 citations98
US5611251AMar 18, 1997
Sintered diamond drill bits and method of making
149 citations98
US5443337AAug 22, 1995
Sintered diamond drill bits and method of making
152 citations98
US6769965B2Aug 3, 2004
Drill bit pointing and dirt removal apparatus and method
3 citations62