Inventor
TSUBOSAKI KUNIHIRO
JP85 patents
⚠️ This page may combine multiple inventors who share the name “TSUBOSAKI KUNIHIRO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
46 patentsUS6342434B1Jan 29, 2002
Methods of processing semiconductor wafer, and producing IC card, and carrier
HITACHI LTD136 citations99
US6291273B1Sep 18, 2001
Plastic molded type semiconductor device and fabrication process thereof
HITACHI LTD208 citations99
US5068712ANov 26, 1991
Semiconductor device
HITACHI LTD165 citations99
US5714405AFeb 3, 1998
Semiconductor device
HITACHI LTD98 citations97
US6589855B2Jul 8, 2003
Methods of processing semiconductor wafer and producing IC card, and carrier
HITACHI LTD57 citations96
US6521981B2Feb 18, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD37 citations96
US6472727B2Oct 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD31 citations96
US6342728B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD38 citations96
US6342726B2Jan 29, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD42 citations96
US6081023AJun 27, 2000
Semiconductor device
HITACHI LTD28 citations96
US5874773AFeb 23, 1999
Lead frame having a supporting pad with a plurality of slits arranged to permit the flow of resin so as to prevent the occurrence of voids
HITACHI LTD78 citations96
US5793099AAug 11, 1998
Semiconductor device
HITACHI LTD30 citations96
US5637913AJun 10, 1997
Leadframe semiconductor integrated circuit device using the same and method of and process for fabricating the two
HITACHI LTD96 citations96
US5612569AMar 18, 1997
Semiconductor device
HITACHI LTD35 citations96
US5583375ADec 10, 1996
Semiconductor device with lead structure within the planar area of the device
HITACHI LTD73 citations96
US5530286AJun 25, 1996
Semiconductor device
HITACHI LTD53 citations96
US5378656AJan 3, 1995
Leadframe, semiconductor integrated circuit device using the same, and method of and process for fabricating the same
HITACHI LTD103 citations96
US5358904AOct 25, 1994
Semiconductor device
HITACHI LTD47 citations96
US4951122AAug 21, 1990
Resin-encapsulated semiconductor device
HITACHI LTD54 citations96
US6114753ASep 5, 2000
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD50 citations95
US5466888ANov 14, 1995
Packaged semiconductor device having stress absorbing film
HITACHI LTD72 citations94
US4803543AFeb 7, 1989
Semiconductor device and process for producing the same
HITACHI LTD54 citations94
US6664616B2Dec 16, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD36 citations93
US6642083B2Nov 4, 2003
Semiconductor device and manufacturing method thereof
HITACHI LTD17 citations93
US6573158B2Jun 3, 2003
Methods of processing semiconductor wafer and producing IC card, and carrier
HITACHI LTD29 citations93
US6365439B2Apr 2, 2002
Method of manufacturing a ball grid array type semiconductor package
HITACHI LTD17 citations93
US6355500B2Mar 12, 2002
Semiconductor device and manufacturing method thereof
HITACHI LTD14 citations93
US6162701ADec 19, 2000
Semiconductor device and method for making same
HITACHI LTD19 citations93
US6140697AOct 31, 2000
Semiconductor device
HITACHI LTD35 citations93
US6130114AOct 10, 2000
Semiconductor device
HITACHI LTD17 citations93
US6100580AAug 8, 2000
Semiconductor device having all outer leads extending from one side of a resin member
HITACHI LTD17 citations93
US6064112AMay 16, 2000
Resin-molded semiconductor device having a lead on chip structure
HITACHI LTD21 citations93
US6018191AJan 25, 2000
Semiconductor device
HITACHI LTD18 citations93
US5986341ANov 16, 1999
Semiconductor device
HITACHI LTD31 citations93
US5431324AJul 11, 1995
Ultrasonic bonding apparatus and quality monitoring method
HITACHI LTD69 citations93
US6515371B2Feb 4, 2003
Semiconductor device with elastic structure and wiring
HITACHI LTD13 citations92
US6396142B1May 28, 2002
Semiconductor device
HITACHI LTD21 citations92
US6307269B1Oct 23, 2001
Semiconductor device with chip size package
HITACHI LTD32 citations92
US6137159AOct 24, 2000
Lead on chip semiconductor device and method of fabricating the same
HITACHI LTD18 citations92
US5406028AApr 11, 1995
Packaged semiconductor device having stress absorbing film
HITACHI LTD24 citations91
US6297544B1Oct 2, 2001
Semiconductor device and method for manufacturing the same
HITACHI LTD17 citations84
US6791194B1Sep 14, 2004
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
HITACHI LTD18 citations83
US6326681B1Dec 4, 2001
Semiconductor device
HITACHI LTD14 citations82
US6303982B2Oct 16, 2001
Semiconductor device
HITACHI LTD10 citations82
US6072231AJun 6, 2000
Semiconductor device
HITACHI LTD12 citations82
US6069029AMay 30, 2000
Semiconductor device chip on lead and lead on chip manufacturing
HITACHI LTD13 citations82
RENESAS TECH CORP
3 patentsUS6670215B2Dec 30, 2003
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations96
US6759272B2Jul 6, 2004
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP28 citations93
US7420284B2Sep 2, 2008
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP39 citations92
AKITA ELECTRONICS SYSTEMS CO L
1 patentShowing the top 50 of 85 patents by PatentIndex Score.