Inventor
INTERRANTE MARIO J
US43 patents
⚠️ This page may combine multiple inventors who share the name “INTERRANTE MARIO J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
40 patentsUS5990418ANov 23, 1999
Hermetic CBGA/CCGA structure with thermal paste cooling
IBM156 citations97
US6283359B1Sep 4, 2001
Method for enhancing fatigue life of ball grid arrays
IBM53 citations96
US6235996B1May 22, 2001
Interconnection structure and process module assembly and rework
IBM65 citations96
US6740959B2May 25, 2004
EMI shielding for semiconductor chip carriers
IBM97 citations94
US6287126B1Sep 11, 2001
Mechanical attachment means used as electrical connection
IBM58 citations94
US6574859B2Jun 10, 2003
Interconnection process for module assembly and rework
IBM18 citations92
US6518674B2Feb 11, 2003
Temporary attach article and method for temporary attach of devices to a substrate
IBM23 citations92
US6458623B1Oct 1, 2002
Conductive adhesive interconnection with insulating polymer carrier
IBM45 citations92
US6216937B1Apr 17, 2001
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM31 citations92
US6158644ADec 12, 2000
Method for enhancing fatigue life of ball grid arrays
IBM43 citations92
US5945735AAug 31, 1999
Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity
IBM21 citations92
US5543584AAug 6, 1996
Structure for repairing electrical lines
IBM21 citations92
US5243140ASep 7, 1993
Direct distribution repair and engineering change system
IBM33 citations92
US5153408AOct 6, 1992
Method and structure for repairing electrical lines
IBM33 citations92
US6429388B1Aug 6, 2002
High density column grid array connections and method thereof
IBM53 citations91
US5288007AFeb 22, 1994
Apparatus and methods for making simultaneous electrical connections
IBM33 citations90
US5193732AMar 16, 1993
Apparatus and methods for making simultaneous electrical connections
IBM49 citations90
US6532654B2Mar 18, 2003
Method of forming an electrical connector
IBM38 citations89
US10262970B2Apr 16, 2019
Selective area heating for 3D chip stack
IBM4 citations84
US9860996B2Jan 2, 2018
Selective area heating for 3D chip stack
IBM6 citations84
US9431366B2Aug 30, 2016
Selective area heating for 3D chip stack
IBM4 citations84
US9373590B1Jun 21, 2016
Integrated circuit bonding with interposer die
IBM9 citations84
US9105629B2Aug 11, 2015
Selective area heating for 3D chip stack
IBM6 citations84
US6037193AMar 14, 2000
Hermetic sealing of a substrate of high thermal conductivity using an interposer of low thermal conductivity
IBM16 citations84
US5425493AJun 20, 1995
Selective addition of a solder ball to an array of solder balls
IBM19 citations82
US4634638AJan 6, 1987
High melting point copper-gold-tin brazing alloy for chip carriers
IBM19 citations79
US6917113B2Jul 12, 2005
Lead-free alloys for column/ball grid arrays, organic interposers and passive component assembly
IBM7 citations74
US6302732B1Oct 16, 2001
Coaxial connection apparatus and method of attachment
IBM14 citations74
US5478009ADec 26, 1995
Selective removal of a single solder ball from an array of solder balls
IBM14 citations74
US6360938B2Mar 26, 2002
Process and apparatus to remove closely spaced chips on a multi-chip module
IBM12 citations73
US6497357B2Dec 24, 2002
Apparatus and method for removing interconnections
IBM8 citations71
US10903187B2Jan 26, 2021
Selective area heating for 3D chip stack
IBM0 citations63
US7781232B2Aug 24, 2010
Method to recover underfilled modules by selective removal of discrete components
IBM6 citations63
US6303400B1Oct 16, 2001
Temporary attach article and method for temporary attach of devices to a substrate
IBM2 citations63
US11810893B2Nov 7, 2023
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
IBM0 citations61
US11049841B2Jun 29, 2021
Silicon interposer sandwich structure for ESD, EMC, and EMC shielding and protection
IBM1 citations61
US6827505B2Dec 7, 2004
Optoelectronic package structure and process for planar passive optical and optoelectronic devices
IBM4 citations60
US9059241B2Jun 16, 2015
3D assembly for interposer bow
IBM1 citations52
US8383505B2Feb 26, 2013
Solder ball contact susceptible to lower stress
IBM0 citations48
US9224712B2Dec 29, 2015
3D bond and assembly process for severely bowed interposer die
IBM0 citations41