Inventor
BOJA RON
US3 patents
Patents
3 patentsUS9716051B2Jul 25, 2017
Open solder mask and or dielectric to increase lid or ring thickness and contact area to improve package coplanarity
NVIDIA CORP2 citations70
US9368422B2Jun 14, 2016
Absorbing excess under-fill flow with a solder trench
NVIDIA CORP2 citations59
US9760132B2Sep 12, 2017
Stiffening electronic packages by disposing a stiffener ring between substrate center area and conductive pad
NVIDIA CORP0 citations49