P

Inventor

SHIOZAWA KATSUOMI

JP30 patents
⚠️ This page may combine multiple inventors who share the name “SHIOZAWA KATSUOMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MITSUBISHI ELECTRIC CORP

26 patents
US6518623B1Feb 11, 2003

Semiconductor device having a buried-channel MOS structure

MITSUBISHI ELECTRIC CORP136 citations98
US6245641B1Jun 12, 2001

Semiconductor device comprising trench isolation insulator film and method of fabricating the same

MITSUBISHI ELECTRIC CORP68 citations96
US5783491AJul 21, 1998

Method of forming a truck MOS gate or a power semiconductor device

MITSUBISHI ELECTRIC CORP85 citations96
US5508534AApr 16, 1996

Trench gate type insulated gate bipolar transistor

MITSUBISHI ELECTRIC CORP78 citations96
US7067874B2Jun 27, 2006

Semiconductor device including trench with at least one of an edge of an opening and a bottom surface being round

MITSUBISHI ELECTRIC CORP13 citations92
US6661066B2Dec 9, 2003

Semiconductor device including inversely tapered gate electrode and manufacturing method thereof

MITSUBISHI ELECTRIC CORP23 citations92
US6518635B1Feb 11, 2003

Semiconductor device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP22 citations92
US6482718B2Nov 19, 2002

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP27 citations92
US6081662AJun 27, 2000

Semiconductor device including trench isolation structure and a method of manufacturing thereof

MITSUBISHI ELECTRIC CORP44 citations92
US5578522ANov 26, 1996

Semiconductor device and method of fabricating same

MITSUBISHI ELECTRIC CORP28 citations92
US6387743B1May 14, 2002

Semiconductor device manufacturing method and semiconductor device

MITSUBISHI ELECTRIC CORP20 citations91
US6333540B1Dec 25, 2001

Semiconductor device manufacturing method and semiconductor device

MITSUBISHI ELECTRIC CORP27 citations91
US7456039B1Nov 25, 2008

Method for manufacturing semiconductor optical device

MITSUBISHI ELECTRIC CORP11 citations84
US6548871B1Apr 15, 2003

Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer

MITSUBISHI ELECTRIC CORP19 citations84
US6383884B1May 7, 2002

Method of manufacturing semiconductor device

MITSUBISHI ELECTRIC CORP16 citations84
US6710401B2Mar 23, 2004

Semiconductor device including a trench with at least one of an edge of an opening and a bottom surface being round

MITSUBISHI ELECTRIC CORP10 citations73
US7964424B2Jun 21, 2011

Method for manufacturing nitride semiconductor light-emitting element

MITSUBISHI ELECTRIC CORP2 citations62
US7582908B2Sep 1, 2009

Nitride semiconductor device and manufacturing method thereof

MITSUBISHI ELECTRIC CORP3 citations62
US7939943B2May 10, 2011

Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer

MITSUBISHI ELECTRIC CORP1 citations52
US7842962B2Nov 30, 2010

Nitride semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP0 citations52
US7795738B2Sep 14, 2010

Nitride semiconductor device

MITSUBISHI ELECTRIC CORP0 citations52
US7791097B2Sep 7, 2010

Nitride semiconductor device and manufacturing method of the same

MITSUBISHI ELECTRIC CORP0 citations52
US7714439B2May 11, 2010

Nitride semiconductor device and method of manufacturing the same

MITSUBISHI ELECTRIC CORP0 citations52
US7683398B2Mar 23, 2010

Nitride semiconductor device having a silicon-containing connection layer and manufacturing method thereof

MITSUBISHI ELECTRIC CORP0 citations52
US7378351B2May 27, 2008

Method of manufacturing nitride semiconductor device

MITSUBISHI ELECTRIC CORP0 citations52
US7678597B2Mar 16, 2010

Method of manufacturing semiconductor device including gallium-nitride semiconductor structure and a palladium contact

MITSUBISHI ELECTRIC CORP0 citations39

RENESAS TECH CORP

3 patents

SHIOZAWA KATSUOMI

1 patent