Inventor
SHIOZAWA KATSUOMI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “SHIOZAWA KATSUOMI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
26 patentsUS6518623B1Feb 11, 2003
Semiconductor device having a buried-channel MOS structure
MITSUBISHI ELECTRIC CORP136 citations98
US6245641B1Jun 12, 2001
Semiconductor device comprising trench isolation insulator film and method of fabricating the same
MITSUBISHI ELECTRIC CORP68 citations96
US5783491AJul 21, 1998
Method of forming a truck MOS gate or a power semiconductor device
MITSUBISHI ELECTRIC CORP85 citations96
US5508534AApr 16, 1996
Trench gate type insulated gate bipolar transistor
MITSUBISHI ELECTRIC CORP78 citations96
US7067874B2Jun 27, 2006
Semiconductor device including trench with at least one of an edge of an opening and a bottom surface being round
MITSUBISHI ELECTRIC CORP13 citations92
US6661066B2Dec 9, 2003
Semiconductor device including inversely tapered gate electrode and manufacturing method thereof
MITSUBISHI ELECTRIC CORP23 citations92
US6518635B1Feb 11, 2003
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP22 citations92
US6482718B2Nov 19, 2002
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP27 citations92
US6081662AJun 27, 2000
Semiconductor device including trench isolation structure and a method of manufacturing thereof
MITSUBISHI ELECTRIC CORP44 citations92
US5578522ANov 26, 1996
Semiconductor device and method of fabricating same
MITSUBISHI ELECTRIC CORP28 citations92
US6387743B1May 14, 2002
Semiconductor device manufacturing method and semiconductor device
MITSUBISHI ELECTRIC CORP20 citations91
US6333540B1Dec 25, 2001
Semiconductor device manufacturing method and semiconductor device
MITSUBISHI ELECTRIC CORP27 citations91
US7456039B1Nov 25, 2008
Method for manufacturing semiconductor optical device
MITSUBISHI ELECTRIC CORP11 citations84
US6548871B1Apr 15, 2003
Semiconductor device achieving reduced wiring length and reduced wiring delay by forming first layer wiring and gate upper electrode in same wire layer
MITSUBISHI ELECTRIC CORP19 citations84
US6383884B1May 7, 2002
Method of manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP16 citations84
US6710401B2Mar 23, 2004
Semiconductor device including a trench with at least one of an edge of an opening and a bottom surface being round
MITSUBISHI ELECTRIC CORP10 citations73
US7964424B2Jun 21, 2011
Method for manufacturing nitride semiconductor light-emitting element
MITSUBISHI ELECTRIC CORP2 citations62
US7582908B2Sep 1, 2009
Nitride semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP3 citations62
US7939943B2May 10, 2011
Nitride semiconductor device including an electrode in ohmic contact with a P-type nitride semiconductor contact layer
MITSUBISHI ELECTRIC CORP1 citations52
US7842962B2Nov 30, 2010
Nitride semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations52
US7795738B2Sep 14, 2010
Nitride semiconductor device
MITSUBISHI ELECTRIC CORP0 citations52
US7791097B2Sep 7, 2010
Nitride semiconductor device and manufacturing method of the same
MITSUBISHI ELECTRIC CORP0 citations52
US7714439B2May 11, 2010
Nitride semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations52
US7683398B2Mar 23, 2010
Nitride semiconductor device having a silicon-containing connection layer and manufacturing method thereof
MITSUBISHI ELECTRIC CORP0 citations52
US7378351B2May 27, 2008
Method of manufacturing nitride semiconductor device
MITSUBISHI ELECTRIC CORP0 citations52
US7678597B2Mar 16, 2010
Method of manufacturing semiconductor device including gallium-nitride semiconductor structure and a palladium contact
MITSUBISHI ELECTRIC CORP0 citations39
RENESAS TECH CORP
3 patentsUS6737315B2May 18, 2004
Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
RENESAS TECH CORP5 citations74
US6890837B2May 10, 2005
Method of manufacturing semiconductor device including steps of forming both insulating film and epitaxial semiconductor on substrate
RENESAS TECH CORP4 citations63
US6707099B2Mar 16, 2004
Semiconductor device and manufacturing method thereof
RENESAS TECH CORP2 citations63