Inventor

HIKITA JUNICHI

JP41 patents

⚠️ This page may combine multiple inventors who share the name “HIKITA JUNICHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIKITA JUNICHI

ROHM CO LTD

Semiconductor device of chip-on-chip structure

Data communication transponder and communications system employing it

Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device

Method of forming through-holes in a wafer and then dicing to form stacked semiconductor devices

Semiconductor device of chip-on-chip structure and semiconductor chip for use therein

Semiconductor device having a plurality of semiconductor chips

IC card and method of using IC card

Semiconductor device and semiconductor chip

Semiconductor chip and production thereof, and semiconductor device having semiconductor chip bonded to solid device

Communications system having an authentication function

Semiconductor device and semiconductor chip for use therein

Semiconductor chip and multichip-type semiconductor device

Semiconductor chip and semiconductor device having a chip-on-chip structure

Semiconductor device and method for manufacturing thereof

Semiconductor device

Semiconductor device

Semiconductor device and semiconductor chip

Personal identification device and electronic apparatus provided therewith

Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips

Production process for semiconductor device

Semiconductor device

Semiconductor device of chip-on-chip structure, assembling process therefor, and semiconductor chip to be bonded to solid surface

Semiconductor device and semiconductor chip for use therein

Semiconductor device and semiconductor chip for use therein

Production process for semiconductor device

Semiconductor chip, chip-on-chip structure device, and assembling method thereof

Semiconductor chip and semiconductor device of chip-on-chip structure

Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips

Semiconductor device

Semiconductor device with package

Semiconductor device with metal peripheral area

Non-volatile memory elements

Semiconductor device for radio communication device, and radio communication device using said semiconductor device

Semiconductor chip and semiconductor device using the same, and method of fabricating semiconductor chip

Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips

Semiconductor device having a primary chip with bumps in joined registration with bumps of a plurality of secondary chips

Semiconductor device having a chip-on-chip structure

Authentication system, authentication device, authentication data producing device, and authentication method

Non contact type IC card

Semiconductor device and manufacturing method thereof

ROHM CO

Semiconductor chip, chip-on-chip structure device and assembling method thereof