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Inventor

LEE XIAOBING

US18 patents
⚠️ This page may combine multiple inventors who share the name “LEE XIAOBING”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

FUTUREWEI TECHNOLOGIES INC

12 patents
US10628343B2Apr 21, 2020

Systems and methods for utilizing DDR4-DRAM chips in hybrid DDR5-DIMMs and for cascading DDR5-DIMMs

FUTUREWEI TECHNOLOGIES INC7 citations83
US10453530B2Oct 22, 2019

RDMA-SSD dual-port unified memory and network controller

FUTUREWEI TECHNOLOGIES INC6 citations83
US9940980B2Apr 10, 2018

Hybrid LPDDR4-DRAM with cached NVM and flash-nand in multi-chip packages for mobile devices

FUTUREWEI TECHNOLOGIES INC6 citations83
US9887008B2Feb 6, 2018

DDR4-SSD dual-port DIMM device

FUTUREWEI TECHNOLOGIES INC10 citations83
US9852779B2Dec 26, 2017

Dual-port DDR4-DIMMs of SDRAM and NVRAM for SSD-blades and multi-CPU servers

FUTUREWEI TECHNOLOGIES INC12 citations83
US9571125B2Feb 14, 2017

Systems and methods of vector-DMA cache-XOR for MPCC erasure coding

FUTUREWEI TECHNOLOGIES INC9 citations80
US10579560B2Mar 3, 2020

Transaction-based hybrid memory

FUTUREWEI TECHNOLOGIES INC2 citations73
US10042565B2Aug 7, 2018

All-flash-array primary storage and caching appliances implementing triple-level cell (TLC)-NAND semiconductor microchips

FUTUREWEI TECHNOLOGIES INC3 citations72
US11449445B2Sep 20, 2022

Transaction-based hybrid memory

FUTUREWEI TECHNOLOGIES INC0 citations62
US11556462B2Jan 17, 2023

Wear-leveling method for cross-point memory for multiple data temperature zones

FUTUREWEI TECHNOLOGIES INC0 citations51
US10453501B2Oct 22, 2019

Hybrid LPDDR4-DRAM with cached NVM and flash-NAND in multi-chip packages for mobile devices

FUTUREWEI TECHNOLOGIES INC0 citations51
US10127074B2Nov 13, 2018

Transaction identification synchronization

FUTUREWEI TECHNOLOGIES INC0 citations42

SARNOFF CORP

3 patents

SEACHANGE INTERNATIONAL INC

2 patents

CRYSTALMEDIA TECHNOLOGY INC

1 patent