Inventor
DIAS RAJEN
US6 patents
Patents
6 patentsUS7078822B2Jul 18, 2006
Microelectronic device interconnects
INTEL CORP52 citations94
US6955947B2Oct 18, 2005
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
INTEL CORP19 citations91
US6812548B2Nov 2, 2004
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
INTEL CORP28 citations91
US6790709B2Sep 14, 2004
Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices
INTEL CORP28 citations91
US7064014B2Jun 20, 2006
Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices
INTEL CORP10 citations72
US7314817B2Jan 1, 2008
Microelectronic device interconnects
INTEL CORP3 citations61