Inventor

BAIK HYUNG GIL

KR4 patents

⚠️ This page may combine multiple inventors who share the name “BAIK HYUNG GIL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HYUNDAI ELECTRONICS IND

2 patents

US6316825B1Nov 13, 2001

Chip stack package utilizing a connecting hole to improve electrical connection between leadframes

HYUNDAI ELECTRONICS IND112 citations96

US6677181B2Jan 13, 2004

Method for fabricating stacked chip package device

HYUNDAI ELECTRONICS IND16 citations91

HYNIX SEMICONDUCTOR INC

2 patents

US6841863B2Jan 11, 2005

Ball grid array package with stacked center pad chips and method for manufacturing the same

HYNIX SEMICONDUCTOR INC24 citations89

US7115442B2Oct 3, 2006

Ball grid array package with stacked center pad chips and method for manufacturing the same

HYNIX SEMICONDUCTOR INC11 citations81