Inventor

STECKERT DANIEL A

US4 patents

⚠️ This page may combine multiple inventors who share the name “STECKERT DANIEL A”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

MICRON TECHNOLOGY INC

2 patents

US7344975B2Mar 18, 2008

Method to reduce charge buildup during high aspect ratio contact etch

MICRON TECHNOLOGY INC5 citations72

US7985692B2Jul 26, 2011

Method to reduce charge buildup during high aspect ratio contact etch

MICRON TECHNOLOGY INC2 citations61

ADVANCED MICRO DEVICES INC

1 patent

US5879975AMar 9, 1999

Heat treating nitrogen implanted gate electrode layer for improved gate electrode etch profile

ADVANCED MICRO DEVICES INC33 citations91

SANDHU GURTEJ S

1 patent

US8673787B2Mar 18, 2014

Method to reduce charge buildup during high aspect ratio contact etch

SANDHU GURTEJ S2 citations61