Inventor
TANG CHEN-YAO
TW3 patents
Patents
3 patentsUS7795735B2Sep 14, 2010
Methods for forming single dies with multi-layer interconnect structures and structures formed therefrom
TAIWAN SEMICONDUCTOR MFG30 citations90
US9343352B2May 17, 2016
Integrated circuit using deep trench through silicon (DTS)
TAIWAN SEMICONDUCTOR MFG0 citations51
US8941211B2Jan 27, 2015
Integrated circuit using deep trench through silicon (DTS)
TAIWAN SEMICONDUCTOR MFG1 citations51